Issued Patents All Time
Showing 1–25 of 36 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12392049 | Controlling plating electrolyte concentration on an electrochemical plating apparatus | Shantinath Ghongadi, Quan Ma, Hyungjun Hur, Cian Sweeney, Quang A. Nguyen +2 more | 2025-08-19 |
| 12219993 | Closure body and cartridge | Xiaoshuo Chen, Su Lu, Quanyi Liu, Chongwei Wang | 2025-02-11 |
| 12180607 | Electrochemical deposition system including optical probes | Andrew James Pfau, Shantinath Ghongadi, Manish Ranjan | 2024-12-31 |
| 11859300 | Controlling plating electrolyte concentration on an electrochemical plating apparatus | Shantinath Ghongadi, Quan Ma, Hyungjun Hur, Cian Sweeney, Quang A. Nguyen +2 more | 2024-01-02 |
| 11401623 | Controlling plating electrolyte concentration on an electrochemical plating apparatus | Shantinath Ghongadi, Quan Ma, Hyungjun Hur, Cian Sweeney, Quang A. Nguyen +2 more | 2022-08-02 |
| 11225727 | Control of current density in an electroplating apparatus | Ashwin Ramesh, Shantinath Ghongadi | 2022-01-18 |
| 10927475 | Controlling plating electrolyte concentration on an electrochemical plating apparatus | Shantinath Ghongadi, Quan Ma, Hyungjun Hur, Cian Sweeney, Quang A. Nguyen +2 more | 2021-02-23 |
| 10689774 | Control of current density in an electroplating apparatus | Ashwin Ramesh, Shantinath Ghongadi | 2020-06-23 |
| 10358738 | Gap fill process stability monitoring of an electroplating process using a potential-controlled exit step | Quan Ma, Shantinath Ghongadi, Bryan Pennington, Tariq Majid, Jonathan D. Reid | 2019-07-23 |
| 10351968 | Front referenced anode | Jingbin Feng, R. Marshall Stowell, Shantinath Ghongadi, Frederick Dean Wilmot | 2019-07-16 |
| 10301739 | Anisotropic high resistance ionic current source (AHRICS) | — | 2019-05-28 |
| 10214829 | Control of current density in an electroplating apparatus | Ashwin Ramesh, Shantinath Ghongadi | 2019-02-26 |
| 10214828 | Control of current density in an electroplating apparatus | Ashwin Ramesh, Shantinath Ghongadi | 2019-02-26 |
| 10053792 | Plating cup with contoured cup bottom | Jingbin Feng, Shantinath Ghongadi, Frederick Dean Wilmot | 2018-08-21 |
| 10023970 | Dynamic current distribution control apparatus and method for wafer electroplating | David W. Porter, Jonathan D. Reid, Frederick Dean Wilmot | 2018-07-17 |
| 10011917 | Control of current density in an electroplating apparatus | Ashwin Ramesh, Shantinath Ghongadi | 2018-07-03 |
| 9909228 | Method and apparatus for dynamic current distribution control during electroplating | — | 2018-03-06 |
| 9822461 | Dynamic current distribution control apparatus and method for wafer electroplating | David W. Porter, Jonathan D. Reid, Frederick Dean Wilmot | 2017-11-21 |
| 9816194 | Control of electrolyte flow dynamics for uniform electroplating | Jian Zhou, Jingbin Feng, Jonathan D. Reid, Shantinath Ghongadi | 2017-11-14 |
| 9670588 | Anisotropic high resistance ionic current source (AHRICS) | — | 2017-06-06 |
| 9512538 | Plating cup with contoured cup bottom | Jingbin Feng, Shantinath Ghongadi, Frederick Dean Wilmot | 2016-12-06 |
| 9481942 | Geometry and process optimization for ultra-high RPM plating | Jian Zhou, Cian Sweeney, Jonathan D. Reid | 2016-11-01 |
| 9340893 | Front referenced anode | Jingbin Feng, R. Marshall Stowell, Shantinath Ghongadi, Frederick Dean Wilmot | 2016-05-17 |
| 9309604 | Method and apparatus for electroplating | Steven T. Mayer, Jingbin Feng, Jonathan D. Reid, Seshasayee Varadarajan | 2016-04-12 |
| 9045841 | Control of electrolyte composition in a copper electroplating apparatus | Bryan L. Buckalew, Jonathan D. Reid, John Sukamto, Seshasayee Varadarajan, Steven T. Mayer | 2015-06-02 |