Issued Patents All Time
Showing 1–25 of 201 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12392047 | Byproduct removal from electroplating solutions | Joseph Richardson, Jae Shin, Jeyavel Velmurugan, Elizabeth Calora, Thomas A. Ponnuswamy | 2025-08-19 |
| 12305307 | TSV process window and fill performance enhancement by long pulsing and ramping | Jae Shin, Joseph Richardson, Jeyavel Velmurugan, Thomas A. Ponnuswamy | 2025-05-20 |
| 12293943 | Gold through silicon mask plating | Lee Peng Chua, Defu Liang, Jacob Kurtis Blickensderfer, Thomas A. Ponnuswamy, Bryan L. Buckalew | 2025-05-06 |
| 12241173 | Wafer shielding for prevention of lipseal plate-out | Gregory J. Kearns, Lee Peng Chua, Jacob Kurtis Blickensderfer | 2025-03-04 |
| 11610782 | Electro-oxidative metal removal in through mask interconnect fabrication | Kari Thorkelsson, Richard Abraham | 2023-03-21 |
| 11549192 | Electroplating apparatus for tailored uniformity profile | David W. Porter, Bryan L. Buckalew, Robert Rash | 2023-01-10 |
| 11542630 | Cleaning electroplating substrate holders using reverse current deplating | Lee Peng Chua, Thomas A. Ponnuswamy, Santosh Kumar | 2023-01-03 |
| 11047059 | Dynamic modulation of cross flow manifold during elecroplating | Kari Thorkelsson, Aaron Berke, Bryan L. Buckalew | 2021-06-29 |
| 11001934 | Methods and apparatus for flow isolation and focusing during electroplating | Stephen J. Banik, II, Bryan L. Buckalew, Aaron Berke, James Isaac Fortner, Justin Oberst +1 more | 2021-05-11 |
| 10989747 | Apparatus for measuring condition of electroplating cell components and associated methods | Mark E. Emerson, Lawrence Ossowski | 2021-04-27 |
| 10982346 | Integrated elastomeric lipseal and cup bottom for reducing wafer sticking | Aaron Berke, Robert Rash, Santosh Kumar, Lee Peng Chua | 2021-04-20 |
| 10954605 | Protecting anodes from passivation in alloy plating systems | Lee Peng Chua, David W. Porter, Thomas A. Ponnuswamy | 2021-03-23 |
| 10920335 | Electroplating apparatus for tailored uniformity profile | David W. Porter, Bryan L. Buckalew, Robert Rash | 2021-02-16 |
| 10923340 | Apparatus and method for electrodeposition of metals with the use of an ionically resistive ionically permeable element having spatially tailored resistivity | Burhanuddin Kagajwala, Bryan L. Buckalew, Lee Peng Chua, Aaron Berke, Robert Rash | 2021-02-16 |
| 10840101 | Wetting pretreatment for enhanced damascene metal filling | David W. Porter, Mark J. Willey | 2020-11-17 |
| 10774438 | Monitoring electrolytes during electroplating | Matthew Thorum | 2020-09-15 |
| 10714436 | Systems and methods for achieving uniformity across a redistribution layer | Bryan L. Buckalew, Thomas A. Ponnuswamy, Stephen J. Banik, II, Justin Oberst | 2020-07-14 |
| 10692735 | Electro-oxidative metal removal in through mask interconnect fabrication | Kari Thorkelsson, Richard Abraham | 2020-06-23 |
| 10669644 | Methods and apparatuses for electroplating and seed layer detection | Daniel Mark Dinneen | 2020-06-02 |
| 10662545 | Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating | Bryan L. Buckalew, Haiying Fu, Thomas A. Ponnuswamy, Hilton Diaz Camilo, Robert Rash +1 more | 2020-05-26 |
| 10538855 | Cleaning electroplating substrate holders using reverse current deplating | Lee Peng Chua, Thomas A. Ponnuswamy, Santosh Kumar | 2020-01-21 |
| 10508359 | TSV bath evaluation using field versus feature contrast | Lee J. Brogan, Matthew Thorum, Joseph Richardson, David W. Porter, Haiying Fu | 2019-12-17 |
| 10472730 | Electrolyte concentration control system for high rate electroplating | Jonathan D. Reid, Seshasayee Varadarajan | 2019-11-12 |
| 10436829 | Apparatus for measuring condition of electroplating cell components and associated methods | Mark E. Emerson, Lawrence Ossowski | 2019-10-08 |
| 10416092 | Remote detection of plating on wafer holding apparatus | Rajan Arora, Jared Herr, Jason Daniel Marchetti, James R. Zibrida | 2019-09-17 |