Issued Patents All Time
Showing 1–25 of 61 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11549192 | Electroplating apparatus for tailored uniformity profile | Steven T. Mayer, Bryan L. Buckalew, Robert Rash | 2023-01-10 |
| 11361868 | Abnormal tissue detection via modal upstream data fusion | William C. Walton, Keith S. Peyton, Susan C. Harvey, Benjamin Tsui | 2022-06-14 |
| 11052613 | Top-loading straddle-mounted pipe fusion machine | Jason A. Lawrence, James R. Perrault, Timothy M. Thoman, Bobby Lee Murray | 2021-07-06 |
| 10998187 | Selective deposition with atomic layer etch reset | Kapu Sirish Reddy, Meliha Gozde Rainville, Nagraj Shankar, Dennis M. Hausmann, David Charles Smith +1 more | 2021-05-04 |
| 10954605 | Protecting anodes from passivation in alloy plating systems | Lee Peng Chua, Steven T. Mayer, Thomas A. Ponnuswamy | 2021-03-23 |
| 10920335 | Electroplating apparatus for tailored uniformity profile | Steven T. Mayer, Bryan L. Buckalew, Robert Rash | 2021-02-16 |
| 10840101 | Wetting pretreatment for enhanced damascene metal filling | Steven T. Mayer, Mark J. Willey | 2020-11-17 |
| 10662545 | Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating | Steven T. Mayer, Bryan L. Buckalew, Haiying Fu, Thomas A. Ponnuswamy, Hilton Diaz Camilo +1 more | 2020-05-26 |
| 10559461 | Selective deposition with atomic layer etch reset | Kapu Sirish Reddy, Meliha Gozde Rainville, Nagraj Shankar, Dennis M. Hausmann, David Charles Smith +1 more | 2020-02-11 |
| 10508359 | TSV bath evaluation using field versus feature contrast | Lee J. Brogan, Steven T. Mayer, Matthew Thorum, Joseph Richardson, Haiying Fu | 2019-12-17 |
| 10369751 | Top-loading straddle-mounted pipe fusion machine | Jason A. Lawrence, James R. Perrault, Timothy M. Thoman, Bobby Lee Murray | 2019-08-06 |
| 10309024 | Electroplating apparatus and process for wafer level packaging | Steven T. Mayer | 2019-06-04 |
| 10208395 | Bubble and foam solutions using a completely immersed air-free feedback flow control valve | Richard Abraham, Robert Rash, Steven T. Mayer, John Floyd Ostrowski | 2019-02-19 |
| 10106907 | Protecting anodes from passivation in alloy plating systems | Lee Peng Chua, Steven T. Mayer, Thomas A. Ponnuswamy | 2018-10-23 |
| 10092933 | Methods and apparatuses for cleaning electroplating substrate holders | Santosh Kumar, Bryan L. Buckalew, Steven T. Mayer, Thomas A. Ponnuswamy, Chad Michael Hosack +2 more | 2018-10-09 |
| 10023970 | Dynamic current distribution control apparatus and method for wafer electroplating | Zhian He, Jonathan D. Reid, Frederick Dean Wilmot | 2018-07-17 |
| 10017869 | Electroplating apparatus for tailored uniformity profile | Steven T. Mayer, Bryan L. Buckalew, Robert Rash | 2018-07-10 |
| 9982357 | Electroplating apparatus and process for wafer level packaging | Steven T. Mayer | 2018-05-29 |
| 9899230 | Apparatus for advanced packaging applications | Bryan L. Buckalew, Steven T. Mayer, Thomas A. Ponnuswamy | 2018-02-20 |
| 9865501 | Method and apparatus for remote plasma treatment for reducing metal oxides on a metal seed layer | Tighe A. Spurlin, George Andrew Antonelli, Natalia V. Doubina, James E. Duncan, Jonathan D. Reid | 2018-01-09 |
| 9852913 | Wetting pretreatment for enhanced damascene metal filling | Steven T. Mayer, Mark J. Willey | 2017-12-26 |
| 9834852 | Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating | Steven T. Mayer, Bryan L. Buckalew, Haiying Fu, Thomas A. Ponnuswamy, Hilton Diaz Camilo +1 more | 2017-12-05 |
| 9822461 | Dynamic current distribution control apparatus and method for wafer electroplating | Zhian He, Jonathan D. Reid, Frederick Dean Wilmot | 2017-11-21 |
| 9816196 | Method and apparatus for electroplating semiconductor wafer when controlling cations in electrolyte | Tighe A. Spurlin, Charles Merrill, Ludan Huang, Matthew Thorum, Lee J. Brogan +9 more | 2017-11-14 |
| 9721800 | Apparatus for wetting pretreatment for enhanced damascene metal filling | Steven T. Mayer, Mark J. Willey, Robert Rash | 2017-08-01 |