Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12012667 | Copper electrofill on non-copper liner layers | Jonathan D. Reid, Yi Liu | 2024-06-18 |
| 11208732 | Monitoring surface oxide on seed layers during electroplating | Ludan Huang, Tighe A. Spurlin, Shantinath Ghongadi, Jonathan D. Reid, Manish Ranjan +2 more | 2021-12-28 |
| 11078591 | Process for optimizing cobalt electrofill using sacrificial oxidants | Natalia V. Doubina, Matthew A. Rigsby, Jonathan D. Reid | 2021-08-03 |
| 10508359 | TSV bath evaluation using field versus feature contrast | Steven T. Mayer, Matthew Thorum, Joseph Richardson, David W. Porter, Haiying Fu | 2019-12-17 |
| 10443146 | Monitoring surface oxide on seed layers during electroplating | Ludan Huang, Tighe A. Spurlin, Shantinath Ghongadi, Jonathan D. Reid, Manish Ranjan +2 more | 2019-10-15 |
| 10329683 | Process for optimizing cobalt electrofill using sacrificial oxidants | Natalia V. Doubina, Matthew A. Rigsby, Jonathan D. Reid | 2019-06-25 |
| 9816196 | Method and apparatus for electroplating semiconductor wafer when controlling cations in electrolyte | Tighe A. Spurlin, Charles Merrill, Ludan Huang, Matthew Thorum, James E. Duncan +9 more | 2017-11-14 |
| 9689083 | TSV bath evaluation using field versus feature contrast | Steven T. Mayer, Matthew Thorum, Joseph Richardson, David W. Porter, Haiying Fu | 2017-06-27 |