Issued Patents All Time
Showing 1–25 of 41 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12392049 | Controlling plating electrolyte concentration on an electrochemical plating apparatus | Zhian He, Quan Ma, Hyungjun Hur, Cian Sweeney, Quang A. Nguyen +2 more | 2025-08-19 |
| 12189369 | In-situ sensor-fusion with artificial intelligence | Yu Ding, Quan Ma, Gerramine S. Manuguid, Robert Marshall Stowell | 2025-01-07 |
| 12180607 | Electrochemical deposition system including optical probes | Andrew James Pfau, Zhian He, Manish Ranjan | 2024-12-31 |
| 12157950 | Lipseals and contact elements for semiconductor electroplating apparatuses | Jingbin Feng, Robert Marshall Stowell, Ashwin Ramesh | 2024-12-03 |
| 12105039 | Systems and methods for in-situ measurement of sheet resistance on substrates | Manish Ranjan, Andrew James Pfau, Douglas Hill, Douglas Koeller, Burton Williams | 2024-10-01 |
| 11859300 | Controlling plating electrolyte concentration on an electrochemical plating apparatus | Zhian He, Quan Ma, Hyungjun Hur, Cian Sweeney, Quang A. Nguyen +2 more | 2024-01-02 |
| 11512408 | Lipseals and contact elements for semiconductor electroplating apparatuses | Jingbin Feng, Robert Marshall Stowell, Ashwin Ramesh | 2022-11-29 |
| 11401623 | Controlling plating electrolyte concentration on an electrochemical plating apparatus | Zhian He, Quan Ma, Hyungjun Hur, Cian Sweeney, Quang A. Nguyen +2 more | 2022-08-02 |
| 11225727 | Control of current density in an electroplating apparatus | Zhian He, Ashwin Ramesh | 2022-01-18 |
| 11208732 | Monitoring surface oxide on seed layers during electroplating | Ludan Huang, Lee J. Brogan, Tighe A. Spurlin, Jonathan D. Reid, Manish Ranjan +2 more | 2021-12-28 |
| 10968531 | Wetting wave front control for reduced air entrapment during wafer entry into electroplating bath | Manish Ranjan, Frederick Dean Wilmot, Douglas Hill, Bryan L. Buckalew | 2021-04-06 |
| 10927475 | Controlling plating electrolyte concentration on an electrochemical plating apparatus | Zhian He, Quan Ma, Hyungjun Hur, Cian Sweeney, Quang A. Nguyen +2 more | 2021-02-23 |
| 10745817 | Configuration and method of operation of an electrodeposition system for improved process stability and performance | Kousik Ganesan, Tighe A. Spurlin, Jonathan D. Reid, Andrew John McKerrow, James E. Duncan | 2020-08-18 |
| 10689774 | Control of current density in an electroplating apparatus | Zhian He, Ashwin Ramesh | 2020-06-23 |
| 10497592 | Methods and apparatuses for estimating on-wafer oxide layer reduction effectiveness via color sensing | Manish Ranjan, Cian Sweeney | 2019-12-03 |
| 10443146 | Monitoring surface oxide on seed layers during electroplating | Ludan Huang, Lee J. Brogan, Tighe A. Spurlin, Jonathan D. Reid, Manish Ranjan +2 more | 2019-10-15 |
| 10358738 | Gap fill process stability monitoring of an electroplating process using a potential-controlled exit step | Quan Ma, Zhian He, Bryan Pennington, Tariq Majid, Jonathan D. Reid | 2019-07-23 |
| 10351968 | Front referenced anode | Jingbin Feng, R. Marshall Stowell, Zhian He, Frederick Dean Wilmot | 2019-07-16 |
| 10214829 | Control of current density in an electroplating apparatus | Zhian He, Ashwin Ramesh | 2019-02-26 |
| 10214828 | Control of current density in an electroplating apparatus | Zhian He, Ashwin Ramesh | 2019-02-26 |
| 10053792 | Plating cup with contoured cup bottom | Zhian He, Jingbin Feng, Frederick Dean Wilmot | 2018-08-21 |
| 10011917 | Control of current density in an electroplating apparatus | Zhian He, Ashwin Ramesh | 2018-07-03 |
| 9988734 | Lipseals and contact elements for semiconductor electroplating apparatuses | Jingbin Feng, Robert Marshall Stowell, Ashwin Ramesh | 2018-06-05 |
| 9816196 | Method and apparatus for electroplating semiconductor wafer when controlling cations in electrolyte | Tighe A. Spurlin, Charles Merrill, Ludan Huang, Matthew Thorum, Lee J. Brogan +9 more | 2017-11-14 |
| 9816193 | Configuration and method of operation of an electrodeposition system for improved process stability and performance | Kousik Ganesan, Tighe A. Spurlin, Jonathan D. Reid, Andrew John McKerrow, James E. Duncan | 2017-11-14 |