Issued Patents All Time
Showing 25 most recent of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12230495 | Method of depositing silicon nitride films | James S. Sims, Shane Tang, Vikrant Rai, Huatan Qiu | 2025-02-18 |
| 11832533 | Conformal damage-free encapsulation of chalcogenide materials | James S. Sims, Meihua Shen, Thorsten Lill, Shane Tang, Kathryn M. Kelchner +4 more | 2023-11-28 |
| 11239420 | Conformal damage-free encapsulation of chalcogenide materials | James S. Sims, Meihua Shen, Thorsten Lill, Shane Tang, Kathryn M. Kelchner +4 more | 2022-02-01 |
| 11075127 | Suppressing interfacial reactions by varying the wafer temperature throughout deposition | Seshasayee Varadarajan, Aaron R. Fellis, James S. Sims, Ramesh Chandrasekharan, Jon Henri | 2021-07-27 |
| 10745817 | Configuration and method of operation of an electrodeposition system for improved process stability and performance | Kousik Ganesan, Tighe A. Spurlin, Jonathan D. Reid, Shantinath Ghongadi, James E. Duncan | 2020-08-18 |
| 10454029 | Method for reducing the wet etch rate of a sin film without damaging the underlying substrate | Dennis M. Hausmann | 2019-10-22 |
| 10347547 | Suppressing interfacial reactions by varying the wafer temperature throughout deposition | Seshasayee Varadarajan, Aaron R. Fellis, James S. Sims, Ramesh Chandrasekharan, Jon Henri | 2019-07-09 |
| 10319582 | Methods and apparatus for depositing silicon oxide on metal layers | Bhadri N. Varadarajan, Zhe Gui, Bo Gong | 2019-06-11 |
| 10240236 | Clean resistant windows for ultraviolet thermal processing | James Lee, George Andrew Antonelli, Kevin McLaughlin, Curtis Bailey, Alexander R. Fox +5 more | 2019-03-26 |
| 10043655 | Plasma activated conformal dielectric film deposition | Shankar Swaminathan, Jon Henri, Dennis M. Hausmann, Pramod Subramonium, Mandyam Sriram +3 more | 2018-08-07 |
| 10020188 | Method for depositing ALD films using halide-based precursors | James S. Sims, Jon Henri, Ramesh Chandrasekharan, Seshasayee Varadarajan, Kathryn M. Kelchner | 2018-07-10 |
| 9824884 | Method for depositing metals free ald silicon nitride films using halide-based precursors | James S. Sims, Jon Henri, Ramesh Chandrasekharan, Seshasayee Varadarajan, Kathryn M. Kelchner | 2017-11-21 |
| 9816193 | Configuration and method of operation of an electrodeposition system for improved process stability and performance | Kousik Ganesan, Tighe A. Spurlin, Jonathan D. Reid, Shantinath Ghongadi, James E. Duncan | 2017-11-14 |
| 9570274 | Plasma activated conformal dielectric film deposition | Shankar Swaminathan, Jon Henri, Dennis M. Hausmann, Pramod Subramonium, Mandyam Sriram +3 more | 2017-02-14 |
| 9502255 | Low-k damage repair and pore sealing agents with photosensitive end groups | George Andrew Antonelli | 2016-11-22 |
| 8999859 | Plasma activated conformal dielectric film deposition | Shankar Swaminathan, Jon Henri, Dennis M. Hausmann, Pramod Subramonium, Mandyam Sriram +3 more | 2015-04-07 |
| 8637411 | Plasma activated conformal dielectric film deposition | Shankar Swaminathan, Jon Henri, Dennis M. Hausmann, Pramod Subramonium, Mandyam Sriram +3 more | 2014-01-28 |
| 7678713 | Energy beam treatment to improve packaging reliability | Ting Tsui, Satyavolu Srinivas Papa Rao, Robert J. Kraft | 2010-03-16 |
| 7342315 | Method to increase mechanical fracture robustness of porous low k dielectric materials | Ting Tsui, Jeannette Michelle Jacques | 2008-03-11 |
| 7087518 | Method of passivating and/or removing contaminants on a low-k dielectric/copper surface | David Gerald Farber, William W. Dostalik, Robert J. Kraft, Kenneth Newton, Ting Tsui | 2006-08-08 |
| 6872665 | Process flow for dual damescene interconnect structures | Francis G. Celii, Guoqiang Xing, Andrew Ralston, Zhicheng Tang, Kenneth Newton +2 more | 2005-03-29 |
| 6861348 | Pre-pattern surface modification of low-k dielectrics | Brian K. Kirkpatrick, Michael Morrison, Kenneth Newton, Dirk N. Anderson | 2005-03-01 |
| 6838300 | Chemical treatment of low-k dielectric films | Changming Jin, Phillip D. Matz, Heungsoo Park, Patricia B. Smith | 2005-01-04 |
| 6831008 | Nickel silicide—silicon nitride adhesion through surface passivation | Jiong-Ping Lu, Glenn J. Tessmer, Melissa Hewson, Donald Miles, Ralf B. Willecke +2 more | 2004-12-14 |
| 6806103 | Method for fabricating semiconductor devices that uses efficient plasmas | Ting Tsui, Yuji Richard Kuan | 2004-10-19 |