Issued Patents All Time
Showing 25 most recent of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7910936 | N2 based plasma treatment for enhanced sidewall smoothing and pore sealing of porous low-k dielectric films | Sameer Ajmera, Changming Jin | 2011-03-22 |
| 7476602 | N2 based plasma treatment for enhanced sidewall smoothing and pore sealing porous low-k dielectric films | Sameer Ajmera, Changming Jin | 2009-01-13 |
| 7413994 | Hydrogen and oxygen based photoresist removal process | Laura M. Matz, Vinay Shah | 2008-08-19 |
| 7344951 | Surface preparation method for selective and non-selective epitaxial growth | Majid Mansoori, Shirin Siddiqui | 2008-03-18 |
| 7253124 | Process for defect reduction in electrochemical plating | Jiong-Ping Lu | 2007-08-07 |
| 7232768 | Hydrogen plasma photoresist strip and polymeric residue cleanup process for low dielectric constant materials | Mona Eissa | 2007-06-19 |
| 7179751 | Hydrogen plasma photoresist strip and polymeric residue cleanup process for low dielectric constant materials | Mona Eissa | 2007-02-20 |
| 7101788 | Semiconductor devices and methods of manufacturing such semiconductor devices | Jiong-Ping Lu | 2006-09-05 |
| 7067441 | Damage-free resist removal process for ultra-low-k processing | Phillip D. Matz | 2006-06-27 |
| 7001848 | Hydrogen plasma photoresist strip and polymeric residue cleanup process for oxygen-sensitive materials | David B. Aldrich, Stephen W. Russell | 2006-02-21 |
| 6967173 | Hydrogen plasma photoresist strip and polymeric residue cleanup processs for low dielectric constant materials | Mona Eissa | 2005-11-22 |
| 6958294 | Method for photoresist strip, sidewall polymer removal and passivation for aluminum metallization | Guoqiang Xing, David B. Aldrich | 2005-10-25 |
| 6838300 | Chemical treatment of low-k dielectric films | Changming Jin, Phillip D. Matz, Heungsoo Park, Andrew John McKerrow | 2005-01-04 |
| 6727185 | Dry process for post oxide etch residue removal | Antonio Luis Pacheco Rotondaro, David B. Aldrich, Eric C. Williams | 2004-04-27 |
| 6713402 | Methods for polymer removal following etch-stop layer etch | Heungsoo Park | 2004-03-30 |
| 6599829 | Method for photoresist strip, sidewall polymer removal and passivation for aluminum metallization | Guoqiang Xing, David B. Aldrich | 2003-07-29 |
| 6342446 | Plasma process for organic residue removal from copper | Antonio Luis Pacheco Rotondaro | 2002-01-29 |
| 6277733 | Oxygen-free, dry plasma process for polymer removal | — | 2001-08-21 |
| 6251771 | Hydrogen passivation of chemical-mechanically polished copper-containing layers | Girish Dixit, Eden Zielinski, Stephen W. Russell | 2001-06-26 |
| 5318666 | Method for via formation and type conversion in group II and group VI materials | Jerome L. Elkind, Glennis Orloff | 1994-06-07 |
| 5157000 | Method for dry etching openings in integrated circuit layers | Jerome L. Elkind, Larry D. Hutchins, Joseph D. Luttmer, Rudy L. York, Julie S. England | 1992-10-20 |
| 5077092 | Method and apparatus for deposition of zinc sulfide films | Larry D. Hutchins, Rudy L. York, Joseph D. Luttmer, Cecil J. Davis | 1991-12-31 |
| 5017511 | Method for dry etching vias in integrated circuit layers | Jerome L. Elkind, Larry D. Hutchins, Joseph D. Luttmer, Rudy L. York, Julie S. England | 1991-05-21 |
| 4988533 | Method for deposition of silicon oxide on a wafer | Dean W. Freeman, Joseph D. Luttmer, Cecil J. Davis | 1991-01-29 |
| 4877757 | Method of sequential cleaning and passivating a GaAs substrate using remote oxygen plasma | Rudy L. York, Joseph D. Luttmer, Cecil J. Davis | 1989-10-31 |