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High-density capacitor for focal plane arrays |
Eugene E. Krueger |
2024-09-17 |
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Transitioned film growth for conductive semiconductor materials |
Athanasios J. Syllaios, Michael Taylor |
2014-07-01 |
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N2 based plasma treatment for enhanced sidewall smoothing and pore sealing of porous low-k dielectric films |
Patricia B. Smith, Changming Jin |
2011-03-22 |
| 7781884 |
Method of fabrication of on-chip heat pipes and ancillary heat transfer components |
Phillip D. Matz, Stephan Grunow, Satyavolu Srinivas Papa Rao |
2010-08-24 |
| 7732324 |
Semiconductor device having improved adhesion and reduced blistering between etch stop layer and dielectric layer |
Ju-Ai Ruan, Changming Jin, Anand J. Reddy, Tae Seung Kim |
2010-06-08 |
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Method for manufacturing an isolation structure using an energy beam treatment |
Puneet Kohli, Manoj Mehrotra, Jin Zhao |
2009-04-28 |
| 7476602 |
N2 based plasma treatment for enhanced sidewall smoothing and pore sealing porous low-k dielectric films |
Patricia B. Smith, Changming Jin |
2009-01-13 |
| 7465635 |
Method for manufacturing a gate sidewall spacer using an energy beam treatment |
Puneet Kohli, Manoj Mehrotra, Jin Zhao |
2008-12-16 |
| 7338893 |
Integration of pore sealing liner into dual-damascene methods and devices |
Edward R. Engbrecht, Satyavolu Srinivas Papa Rao, Stephan Grunow |
2008-03-04 |
| 7189615 |
Single mask MIM capacitor and resistor with in trench copper drift barrier |
Satyavolu Srinivas Papa Rao, Darius Crenshaw, Stephan Grunow, Kenneth D. Brennan, Somit Joshi +3 more |
2007-03-13 |
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Metal insulator metal (MIM) capacitor fabrication with sidewall barrier removal aspect |
Darius Crenshaw, Stephan Grunow, Satyavolu S. Papa Rao, Phillip D. Matz |
2006-10-03 |
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Method to reduce silanol and improve barrier properties in low k dielectric ic interconnects |
Phillip D. Matz, Changming Jin, Trace Hurd |
2006-05-02 |