SA

Sameer Ajmera

TI Texas Instruments: 10 patents #1,445 of 12,488Top 15%
DS Drs Network & Imaging Systems: 1 patents #55 of 78Top 75%
LC L-3 Communications: 1 patents #229 of 507Top 50%
Overall (All Time): #404,655 of 4,157,543Top 10%
12
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
12094891 High-density capacitor for focal plane arrays Eugene E. Krueger 2024-09-17
8765514 Transitioned film growth for conductive semiconductor materials Athanasios J. Syllaios, Michael Taylor 2014-07-01
7910936 N2 based plasma treatment for enhanced sidewall smoothing and pore sealing of porous low-k dielectric films Patricia B. Smith, Changming Jin 2011-03-22
7781884 Method of fabrication of on-chip heat pipes and ancillary heat transfer components Phillip D. Matz, Stephan Grunow, Satyavolu Srinivas Papa Rao 2010-08-24
7732324 Semiconductor device having improved adhesion and reduced blistering between etch stop layer and dielectric layer Ju-Ai Ruan, Changming Jin, Anand J. Reddy, Tae Seung Kim 2010-06-08
7524777 Method for manufacturing an isolation structure using an energy beam treatment Puneet Kohli, Manoj Mehrotra, Jin Zhao 2009-04-28
7476602 N2 based plasma treatment for enhanced sidewall smoothing and pore sealing porous low-k dielectric films Patricia B. Smith, Changming Jin 2009-01-13
7465635 Method for manufacturing a gate sidewall spacer using an energy beam treatment Puneet Kohli, Manoj Mehrotra, Jin Zhao 2008-12-16
7338893 Integration of pore sealing liner into dual-damascene methods and devices Edward R. Engbrecht, Satyavolu Srinivas Papa Rao, Stephan Grunow 2008-03-04
7189615 Single mask MIM capacitor and resistor with in trench copper drift barrier Satyavolu Srinivas Papa Rao, Darius Crenshaw, Stephan Grunow, Kenneth D. Brennan, Somit Joshi +3 more 2007-03-13
7115467 Metal insulator metal (MIM) capacitor fabrication with sidewall barrier removal aspect Darius Crenshaw, Stephan Grunow, Satyavolu S. Papa Rao, Phillip D. Matz 2006-10-03
7037823 Method to reduce silanol and improve barrier properties in low k dielectric ic interconnects Phillip D. Matz, Changming Jin, Trace Hurd 2006-05-02