| 7969274 |
Method to improve inductance with a high-permeability slotted plate core in an integrated circuit |
Satyavolu S. Papa Rao, Byron Lovell Williams |
2011-06-28 |
| 7436281 |
Method to improve inductance with a high-permeability slotted plate core in an integrated circuit |
Satyavolu S. Papa Rao, Byron Lovell Williams |
2008-10-14 |
| 7397107 |
Ferromagnetic capacitor |
Satyavolu S. Papa Rao |
2008-07-08 |
| 7250334 |
Metal insulator metal (MIM) capacitor fabrication with sidewall spacers and aluminum cap (ALCAP) top electrode |
Darius Crenshaw, Byron Lovell Williams, Alwin Tsao, Hisashi Shichijo, Satyavolu S. Papa Rao +1 more |
2007-07-31 |
| 7189615 |
Single mask MIM capacitor and resistor with in trench copper drift barrier |
Satyavolu Srinivas Papa Rao, Darius Crenshaw, Stephan Grunow, Somit Joshi, Montray Leavy +3 more |
2007-03-13 |
| 7118925 |
Fabrication of a ferromagnetic inductor core and capacitor electrode in a single photo mask step |
Satyavolu S. Papa Rao |
2006-10-10 |
| 7109838 |
System for integrating a toroidal inductor in a semiconductor device |
Douglas A. Prinslow, David B. Aldrich |
2006-09-19 |
| 6984580 |
Dual damascene pattern liner |
William W. Dostalik, Robert J. Kraft |
2006-01-10 |
| 6951812 |
Copper transition layer for improving copper interconnection reliability |
Qing Jiang, Robert Tsu |
2005-10-04 |
| 6911389 |
Self aligned vias in dual damascene interconnect, buried mask approach |
Paul Gillespie |
2005-06-28 |
| 6903918 |
Shielded planar capacitor |
— |
2005-06-07 |
| 6787875 |
Self-aligned vias in an integrated circuit structure |
Paul Gillespie |
2004-09-07 |
| 6693356 |
Copper transition layer for improving copper interconnection reliability |
Qing Jiang, Robert Tsu |
2004-02-17 |
| 6620727 |
Aluminum hardmask for dielectric etch |
— |
2003-09-16 |
| 6605536 |
Treatment of low-k dielectric films to enable patterning of deep submicron features |
Mona Eissa, Guoqiang Xing, Hyesook Hong |
2003-08-12 |
| 6600208 |
Versatile system for integrated circuit containing shielded inductor |
Douglas A. Prinslow, David B. Aldrich |
2003-07-29 |
| 6548400 |
Method of fabricating interlevel connectors using only one photomask step |
Qing Jiang |
2003-04-15 |
| 6465339 |
Technique for intralevel capacitive isolation of interconnect paths |
Keith Brankner, Yvette Shaw |
2002-10-15 |
| 6246120 |
Sidewalls for guiding the via etch |
David B. Aldrich, Eden Zielinski, Peter S. McAnally |
2001-06-12 |
| 6074943 |
Sidewalls for guiding the via etch |
David B. Aldrich, Eden Zielinski, Peter S. McAnally |
2000-06-13 |
| 5998297 |
Method of etching copper or copper-doped aluminum |
— |
1999-12-07 |
| 5880026 |
Method for air gap formation by plasma treatment of aluminum interconnects |
Guoqiang Xing |
1999-03-09 |