Issued Patents All Time
Showing 25 most recent of 44 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10229875 | Stacked via structure for metal fuse applications | Griselda Bonilla, Kaushik Chanda, Ronald G. Filippi, Naftali E. Lustig, Andrew H. Simon +1 more | 2019-03-12 |
| 9893011 | Back-end electrically programmable fuse | Junjing Bao, Griselda Bonilla, Kaushik Chanda, Samuel S. Choi, Ronald G. Filippi +3 more | 2018-02-13 |
| 9685404 | Back-end electrically programmable fuse | Junjing Bao, Griselda Bonilla, Kaushik Chanda, Samuel S. Choi, Ronald G. Filippi +3 more | 2017-06-20 |
| 9425144 | Metal fuse structure for improved programming capability | Griselda Bonilla, Kaushik Chanda, Samuel S. Choi, Ronald G. Filippi, Naftali E. Lustig +2 more | 2016-08-23 |
| 9360525 | Stacked via structure for metal fuse applications | Griselda Bonilla, Kaushik Chanda, Ronald G. Filippi, Naftali E. Lustig, Andrew H. Simon +1 more | 2016-06-07 |
| 9142506 | E-fuse structures and methods of manufacture | Griselda Bonilla, Kaushik Chanda, Samuel S. Choi, Ronald G. Filippi, Naftali E. Lustig +1 more | 2015-09-22 |
| 9093164 | Redundant via structure for metal fuse applications | Ronald G. Filippi, Griselda Bonilla, Kaushik Chanda, Samuel S. Choi, Naftali E. Lustig +1 more | 2015-07-28 |
| 9059169 | E-fuse structures and methods of manufacture | Griselda Bonilla, Kaushik Chanda, Samuel S. Choi, Ronald G. Filippi, Naftali E. Lustig +1 more | 2015-06-16 |
| 8962467 | Metal fuse structure for improved programming capability | Griselda Bonilla, Kaushik Chanda, Samuel S. Choi, Ronald G. Filippi, Naftali E. Lustig +2 more | 2015-02-24 |
| 8836124 | Fuse and integrated conductor | Griselda Bonilla, Kaushik Chanda, Samuel S. Choi, Ronald G. Filippi, Naftali E. Lustig +1 more | 2014-09-16 |
| 8742766 | Stacked via structure for metal fuse applications | Griselda Bonilla, Kaushik Chanda, Ronald G. Filippi, Naftali E. Lustig, Andrew H. Simon +1 more | 2014-06-03 |
| 8633707 | Stacked via structure for metal fuse applications | Ronald G. Filippi, Griselda Bonilla, Kaushik Chanda, Naftali E. Lustig, Andrew H. Simon +1 more | 2014-01-21 |
| 8444868 | Method for removing copper oxide layer | Tien-Jen Cheng, Zhengwen Li, Huilong Zhu | 2013-05-21 |
| 8367544 | Self-aligned patterned etch stop layers for semiconductor devices | Kangguo Cheng, Lawrence A. Clevenger, Johnathan E. Faltermeier, Kaushik A. Kumar, Kevin S. Petrarca | 2013-02-05 |
| 8298948 | Capping of copper interconnect lines in integrated circuit devices | Griselda Bonilla, Kaushik Chanda, Ronald G. Filippi, David L. Rath, Sujatha Sankaran +3 more | 2012-10-30 |
| 8232646 | Interconnect structure for integrated circuits having enhanced electromigration resistance | Griselda Bonilla, Kaushik Chanda, Ronald G. Filippi, Chao-Kun Hu, Naftali E. Lustig +2 more | 2012-07-31 |
| 8211794 | Properties of metallic copper diffusion barriers through silicon surface treatments | Valli Arunachalam, Satyavolu Srinivas Papa Rao, Sanjeev Aggarwal | 2012-07-03 |
| 8056039 | Interconnect structure for integrated circuits having improved electromigration characteristics | Kaushik Chanda, Ronald G. Filippi, Chao-Kun Hu, Sujatha Sankaran, Andrew H. Simon +1 more | 2011-11-08 |
| 8026166 | Interconnect structures comprising capping layers with low dielectric constants and methods of making the same | Griselda Bonilla, Tien-Jen Cheng, Lawrence A. Clevenger, Chao-Kun Hu, Roger A. Quon +5 more | 2011-09-27 |
| 7985928 | Gap free anchored conductor and dielectric structure and method for fabrication thereof | Tibor Bolom, David L. Rath, Andrew H. Simon | 2011-07-26 |
| 7888252 | Self-aligned contact | Johnathan E. Faltermeier, Kangguo Cheng, Kevin S. Petrarca, Kaushik A. Kumar, Lawrence A. Clevenger +2 more | 2011-02-15 |
| 7833893 | Method for forming conductive structures | Kaushik A. Kumar, Kevin S. Petrarca, Richard P. Volant | 2010-11-16 |
| 7825019 | Structures and methods for reduction of parasitic capacitances in semiconductor integrated circuits | Lawrence A. Clevenger, Kaushik A. Kumar, Kevin S. Petrarca, Vidhya Ramachandran | 2010-11-02 |
| 7781884 | Method of fabrication of on-chip heat pipes and ancillary heat transfer components | Sameer Ajmera, Phillip D. Matz, Satyavolu Srinivas Papa Rao | 2010-08-24 |
| 7776737 | Reliability of wide interconnects | Griselda Bonilla, Kaushik Chanda, Ronald G. Filippi, Sujatha Sankaran, Andrew H. Simon +1 more | 2010-08-17 |