| 10229875 |
Stacked via structure for metal fuse applications |
Griselda Bonilla, Kaushik Chanda, Ronald G. Filippi, Naftali E. Lustig, Andrew H. Simon +1 more |
2019-03-12 |
$2,141,000 |
| 9893011 |
Back-end electrically programmable fuse |
Junjing Bao, Griselda Bonilla, Kaushik Chanda, Samuel S. Choi, Ronald G. Filippi +3 more |
2018-02-13 |
$2,196,000 |
| 9685404 |
Back-end electrically programmable fuse |
Junjing Bao, Griselda Bonilla, Kaushik Chanda, Samuel S. Choi, Ronald G. Filippi +3 more |
2017-06-20 |
$2,315,000 |
| 9425144 |
Metal fuse structure for improved programming capability |
Griselda Bonilla, Kaushik Chanda, Samuel S. Choi, Ronald G. Filippi, Naftali E. Lustig +2 more |
2016-08-23 |
$3,675,000 |
| 9360525 |
Stacked via structure for metal fuse applications |
Griselda Bonilla, Kaushik Chanda, Ronald G. Filippi, Naftali E. Lustig, Andrew H. Simon +1 more |
2016-06-07 |
$4,256,000 |
| 9142506 |
E-fuse structures and methods of manufacture |
Griselda Bonilla, Kaushik Chanda, Samuel S. Choi, Ronald G. Filippi, Naftali E. Lustig +1 more |
2015-09-22 |
$4,871,000 |
| 9093164 |
Redundant via structure for metal fuse applications |
Ronald G. Filippi, Griselda Bonilla, Kaushik Chanda, Samuel S. Choi, Naftali E. Lustig +1 more |
2015-07-28 |
$3,451,000 |
| 9059169 |
E-fuse structures and methods of manufacture |
Griselda Bonilla, Kaushik Chanda, Samuel S. Choi, Ronald G. Filippi, Naftali E. Lustig +1 more |
2015-06-16 |
$2,098,000 |
| 8962467 |
Metal fuse structure for improved programming capability |
Griselda Bonilla, Kaushik Chanda, Samuel S. Choi, Ronald G. Filippi, Naftali E. Lustig +2 more |
2015-02-24 |
$3,851,000 |
| 8836124 |
Fuse and integrated conductor |
Griselda Bonilla, Kaushik Chanda, Samuel S. Choi, Ronald G. Filippi, Naftali E. Lustig +1 more |
2014-09-16 |
$3,547,000 |
| 8742766 |
Stacked via structure for metal fuse applications |
Griselda Bonilla, Kaushik Chanda, Ronald G. Filippi, Naftali E. Lustig, Andrew H. Simon +1 more |
2014-06-03 |
$4,638,000 |
| 8633707 |
Stacked via structure for metal fuse applications |
Ronald G. Filippi, Griselda Bonilla, Kaushik Chanda, Naftali E. Lustig, Andrew H. Simon +1 more |
2014-01-21 |
$5,923,000 |
| 8444868 |
Method for removing copper oxide layer |
Tien-Jen Cheng, Zhengwen Li, Huilong Zhu |
2013-05-21 |
$6,083,000 |
| 8367544 |
Self-aligned patterned etch stop layers for semiconductor devices |
Kangguo Cheng, Lawrence A. Clevenger, Johnathan E. Faltermeier, Kaushik A. Kumar, Kevin S. Petrarca |
2013-02-05 |
$5,221,000 |
| 8298948 |
Capping of copper interconnect lines in integrated circuit devices |
Griselda Bonilla, Kaushik Chanda, Ronald G. Filippi, David L. Rath, Sujatha Sankaran +3 more |
2012-10-30 |
|
| 8232646 |
Interconnect structure for integrated circuits having enhanced electromigration resistance |
Griselda Bonilla, Kaushik Chanda, Ronald G. Filippi, Chao-Kun Hu, Naftali E. Lustig +2 more |
2012-07-31 |
$5,473,000 |
| 8211794 |
Properties of metallic copper diffusion barriers through silicon surface treatments |
Valli Arunachalam, Satyavolu Srinivas Papa Rao, Sanjeev Aggarwal |
2012-07-03 |
$8,351,000 |
| 8056039 |
Interconnect structure for integrated circuits having improved electromigration characteristics |
Kaushik Chanda, Ronald G. Filippi, Chao-Kun Hu, Sujatha Sankaran, Andrew H. Simon +1 more |
2011-11-08 |
$3,097,000 |
| 8026166 |
Interconnect structures comprising capping layers with low dielectric constants and methods of making the same |
Griselda Bonilla, Tien-Jen Cheng, Lawrence A. Clevenger, Chao-Kun Hu, Roger A. Quon +5 more |
2011-09-27 |
$6,526,000 |
| 7985928 |
Gap free anchored conductor and dielectric structure and method for fabrication thereof |
Tibor Bolom, David L. Rath, Andrew H. Simon |
2011-07-26 |
|
| 7888252 |
Self-aligned contact |
Johnathan E. Faltermeier, Kangguo Cheng, Kevin S. Petrarca, Kaushik A. Kumar, Lawrence A. Clevenger +2 more |
2011-02-15 |
$3,434,000 |
| 7833893 |
Method for forming conductive structures |
Kaushik A. Kumar, Kevin S. Petrarca, Richard P. Volant |
2010-11-16 |
$4,384,000 |
| 7825019 |
Structures and methods for reduction of parasitic capacitances in semiconductor integrated circuits |
Lawrence A. Clevenger, Kaushik A. Kumar, Kevin S. Petrarca, Vidhya Ramachandran |
2010-11-02 |
$3,442,000 |
| 7781884 |
Method of fabrication of on-chip heat pipes and ancillary heat transfer components |
Sameer Ajmera, Phillip D. Matz, Satyavolu Srinivas Papa Rao |
2010-08-24 |
$6,220,000 |
| 7776737 |
Reliability of wide interconnects |
Griselda Bonilla, Kaushik Chanda, Ronald G. Filippi, Sujatha Sankaran, Andrew H. Simon +1 more |
2010-08-17 |
$4,695,000 |
