| 7781884 |
Method of fabrication of on-chip heat pipes and ancillary heat transfer components |
Sameer Ajmera, Stephan Grunow, Satyavolu Srinivas Papa Rao |
2010-08-24 |
| 7732345 |
Method for using a modified post-etch clean rinsing agent |
Trace Hurd |
2010-06-08 |
| 7727885 |
Reduction of punch-thru defects in damascene processing |
Sopa Chevacharoenkul, Ching-Te Lin, Basab Chatterjee, Anand J. Reddy, Kenneth Newton +1 more |
2010-06-01 |
| 7642619 |
Air gap in integrated circuit inductor fabrication |
Stephan Grunow, Satyavolu S. Papa Rao |
2010-01-05 |
| 7566627 |
Air gap in integrated circuit inductor fabrication |
Stephan Grunow, Satyavolu Srinivas Papa Rao |
2009-07-28 |
| 7485963 |
Use of supercritical fluid for low effective dielectric constant metallization |
Satyavolu S. Papa Rao, Stephan Grunow |
2009-02-03 |
| 7189615 |
Single mask MIM capacitor and resistor with in trench copper drift barrier |
Satyavolu Srinivas Papa Rao, Darius Crenshaw, Stephan Grunow, Kenneth D. Brennan, Somit Joshi +3 more |
2007-03-13 |
| 7179747 |
Use of supercritical fluid for low effective dielectric constant metallization |
Satyavolu S. Papa Rao, Stephan Grunow |
2007-02-20 |
| 7115467 |
Metal insulator metal (MIM) capacitor fabrication with sidewall barrier removal aspect |
Sameer Ajmera, Darius Crenshaw, Stephan Grunow, Satyavolu S. Papa Rao |
2006-10-03 |
| 7067441 |
Damage-free resist removal process for ultra-low-k processing |
Patricia B. Smith |
2006-06-27 |
| 7037823 |
Method to reduce silanol and improve barrier properties in low k dielectric ic interconnects |
Sameer Ajmera, Changming Jin, Trace Hurd |
2006-05-02 |
| 6838300 |
Chemical treatment of low-k dielectric films |
Changming Jin, Heungsoo Park, Patricia B. Smith, Andrew John McKerrow |
2005-01-04 |