| 12105161 |
Layouts for interlevel crack prevention in fluxgate technology manufacturing |
Sudtida Lavangkul |
2024-10-01 |
| 11508721 |
Integrated fluxgate device |
Mona Eissa, Mark R. Kimmich, Sudtida Lavangkul, Mark L. Jenson |
2022-11-22 |
| 11121207 |
Integrated trench capacitor with top plate having reduced voids |
Binghua Hu, Abbas Ali, Jarvis Benjamin Jacobs |
2021-09-14 |
| 10978448 |
Integrated fluxgate device |
Mona Eissa, Mark R. Kimmich, Sudtida Lavangkul, Mark L. Jenson |
2021-04-13 |
| 10005662 |
Selective patterning of titanium encapsulation layers |
Lee Alan Stringer, Mona Eissa, Byron J.R. Shulver, Mark R. Kimmich, Sudtida Lavangkul +1 more |
2018-06-26 |
| 9771261 |
Selective patterning of an integrated fluxgate device |
Lee Alan Stringer, Mona Eissa, Byron J.R. Shulver, Mark R. Kimmich, Sudtida Lavangkul +1 more |
2017-09-26 |
| 9691751 |
In-situ doped polysilicon filler for trenches |
Bhaskar Srinivasan, Khanh Quang Le, Collin White, Ashley J. Norris, Bernard John Fischer |
2017-06-27 |
| 8334190 |
Single step CMP for polishing three or more layer film stacks |
Eugene C. Davis, Binghua Hu, Prakash Dalpatbhai Dev |
2012-12-18 |
| 8110414 |
Forming integrated circuit devices with metal-insulator-metal capacitors using selective etch of top electrodes |
Marshall O. Cathey, Jr., Pushpa Mahalingam, Weidong Tian, David C. Guiling, Xinfen Chen +1 more |
2012-02-07 |
| 7745335 |
Semiconductor device manufactured by reducing hillock formation in metal interconnects |
Ju-Ai Ruan, Changming Jin, Satyavolu Papa Rao, Tae Seung Kim |
2010-06-29 |
| 7727885 |
Reduction of punch-thru defects in damascene processing |
Phillip D. Matz, Ching-Te Lin, Basab Chatterjee, Anand J. Reddy, Kenneth Newton +1 more |
2010-06-01 |