Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8551886 | CMP process for processing STI on two distinct silicon planes | Kyle P. Hunt, Leila Elvira Noriega, Billy Alan Wofford, Asadd M. Hosein, Binghua Hu | 2013-10-08 |
| 8264038 | Buried floating layer structure for improved breakdown | Sameer Pendharkar, Binghua Hu | 2012-09-11 |
| 8148228 | Surface patterned topography feature suitable for planarization | Sameer Pendharkar, Binghua Hu | 2012-04-03 |
| 8110414 | Forming integrated circuit devices with metal-insulator-metal capacitors using selective etch of top electrodes | Marshall O. Cathey, Jr., Pushpa Mahalingam, Weidong Tian, David C. Guiling, Binghua Hu +1 more | 2012-02-07 |
| 7595525 | Integrated circuit capacitor having antireflective dielectric | Bill Wofford, Blake Ryan Pasker, Binghua Hu | 2009-09-29 |
| 7118959 | Integrated circuit capacitor having antireflective dielectric | Bill Wofford, Blake Ryan Pasker, Binghua Hu | 2006-10-10 |
| 7112953 | Method for detecting epitaxial (EPI) induced buried layer shifts in semiconductor devices | Xiaoju Wu, John Kenneth Arch, Qingfeng Wang | 2006-09-26 |