Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10005662 | Selective patterning of titanium encapsulation layers | Mona Eissa, Byron J.R. Shulver, Sopa Chevacharoenkul, Mark R. Kimmich, Sudtida Lavangkul +1 more | 2018-06-26 |
| 9771261 | Selective patterning of an integrated fluxgate device | Mona Eissa, Byron J.R. Shulver, Sopa Chevacharoenkul, Mark R. Kimmich, Sudtida Lavangkul +1 more | 2017-09-26 |
| 8431463 | Capacitor contact formed concurrently with bond pad metallization | Maxwell Lippitt, Stephen Arlon Meisner, Stephen F. Clark, Fred Percy Debnam, II, Byron Lovell Williams | 2013-04-30 |
| 8236703 | Methods for removing contaminants from aluminum-comprising bond pads and integrated circuits therefrom | Alfred Griffin, Lisa A. Fritz, Lin Li, Neel Bhatt, John Paul Campbell +2 more | 2012-08-07 |