Issued Patents All Time
Showing 1–25 of 57 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12355025 | Standalone isolation capacitor | Elizabeth Costner Stewart, Thomas D. Bonifield, Jeffrey Alan West | 2025-07-08 |
| 12230669 | Standalone high voltage galvanic isolation capacitors | Thomas D. Bonifield, Jeffrey Alan West, Elizabeth Costner Stewart | 2025-02-18 |
| 11973052 | Stud bump for wirebonding high voltage isolation barrier connection | Chien-Chang Li, Hung-Yu Chou, Sheng-Wen Huang, Zi-Xian Zhan | 2024-04-30 |
| 11961879 | IC including capacitor having segmented bottom plate | Jeffrey Alan West, Mrinal K. Das, Thomas D. Bonifield, Maxim Franke | 2024-04-16 |
| 11901402 | Standalone isolation capacitor | Elizabeth Costner Stewart, Thomas D. Bonifield, Jeffrey Alan West | 2024-02-13 |
| 11869933 | Device isolator with reduced parasitic capacitance | Raja Selvaraj, Anant Shankar Kamath, Thomas D. Bonifield, John Kenneth Arch | 2024-01-09 |
| 11848297 | Semiconductor device packages with high angle wire bonding and non-gold bond wires | Bo-Hsun Pan, Chien-Chang Li, Hung-Yu Chou, Shawn O'Connor, Jeffrey Alan West +2 more | 2023-12-19 |
| 11784212 | Standalone high voltage galvanic isolation capacitors | Thomas D. Bonifield, Jeffrey Alan West, Elizabeth Costner Stewart | 2023-10-10 |
| 11688760 | IC including capacitor having segmented bottom plate | Jeffrey Alan West, Mrinal K. Das, Thomas D. Bonifield, Maxim Franke | 2023-06-27 |
| 11532693 | Passive components with improved characteristics | Jeffrey Alan West, Elizabeth Costner Stewart, Thomas Dyer Bonifeld | 2022-12-20 |
| 11495553 | Wire bonding between isolation capacitors for multichip modules | Thomas D. Bonifield, Jeffrey Alan West | 2022-11-08 |
| 11227852 | Integrated circuit packaging | Honglin Guo, Jason Chien, Jeffrey Alan West, Anderson Li, Arvin Nono Verdeflor | 2022-01-18 |
| 11205695 | Method of fabricating a thick oxide feature on a semiconductor wafer | Elizabeth Costner Stewart, Jeffrey Alan West, Thomas D. Bonifield, Jay Sung Chun | 2021-12-21 |
| 11107883 | Device isolator with reduced parasitic capacitance | Raja Selvaraj, Anant Shankar Kamath, Thomas D. Bonifield, John Kenneth Arch | 2021-08-31 |
| 11069627 | Scribe seals and methods of making | Thomas D. Bonifield, Jeffrey Alan West, Honglin Guo | 2021-07-20 |
| 11024576 | Semiconductor package with underfill between a sensor coil and a semiconductor die | Jeffrey Alan West, Thomas D. Bonifield | 2021-06-01 |
| 10847605 | Methods and apparatus for high voltage integrated circuit capacitors | Jeffrey Alan West, Thomas D. Bonifield | 2020-11-24 |
| 10811492 | Method and device for patterning thick layers | Jeffrey Alan West, John B. Robbins | 2020-10-20 |
| 10707297 | High voltage galvanic isolation device | Jeffrey Alan West, Thomas D. Bonifield | 2020-07-07 |
| 10679935 | Structure and method for improving high voltage breakdown reliability of a microelectronic device | Jeffrey Alan West, David Leonard Larkin, Weidong Tian | 2020-06-09 |
| 10629562 | Integrated circuit packaging | Honglin Guo, Jason Chien, Jeffrey Alan West, Anderson Li, Arvin Nono Verdeflor | 2020-04-21 |
| 10546821 | Opening in a multilayer polymeric dielectric layer without delamination | Licheng M. Han, Michael Andrew Serafin, Sandra Rodriguez Varela, Salvatore Pavone | 2020-01-28 |
| 10418320 | Structure and method for improving high voltage breakdown reliability of a microelectronic device | Jeffrey Alan West, David Leonard Larkin, Weidong Tian | 2019-09-17 |
| 10366958 | Wire bonding between isolation capacitors for multichip modules | Thomas D. Bonifield, Jeffrey Alan West | 2019-07-30 |
| 10349526 | Integrated circuit with micro inductor and micro transformer with magnetic core | Asad Haider, Licheng M. Han | 2019-07-09 |