Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10546821 | Opening in a multilayer polymeric dielectric layer without delamination | Michael Andrew Serafin, Byron Lovell Williams, Sandra Rodriguez Varela, Salvatore Pavone | 2020-01-28 |
| 10349526 | Integrated circuit with micro inductor and micro transformer with magnetic core | Byron Lovell Williams, Asad Haider | 2019-07-09 |
| 10251280 | Integrated circuit with micro inductor and micro transformer with magnetic core | Byron Lovell Williams, Asad Haider | 2019-04-02 |
| 9502365 | Opening in a multilayer polymeric dielectric layer without delamination | Michael Andrew Serafin, Byron Lovell Williams, Sandra Rodriguez Varela, Salvatore Pavone | 2016-11-22 |
| 6730591 | Method of using silicon rich carbide as a barrier material for fluorinated materials | Xu Yi, Simon Chooi, Mei Sheng Zhou, Joseph Xie | 2004-05-04 |
| 6429129 | Method of using silicon rich carbide as a barrier material for fluorinated materials | Xu Yi, Simon Chooi, Mei Sheng Zhou, Joseph Xie | 2002-08-06 |
| 6424044 | Use of boron carbide as an etch-stop and barrier layer for copper dual damascene metallization | Xu Yi, Joseph Xie, Mei Sheng Zhou, Simon Chooi | 2002-07-23 |
| 6352921 | Use of boron carbide as an etch-stop and barrier layer for copper dual damascene metallization | Yi Xu, Joseph Xie, Mei Sheng Zhou, Simon Chooi | 2002-03-05 |
| 6214423 | Method of forming a polymer on a surface | Wei William Lee, Richard B. Timmons | 2001-04-10 |