Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10529561 | Method of fabricating non-etch gas cooled epitaxial stack for group IIIA-N devices | Qhalid Fareed | 2020-01-07 |
| 10354858 | Process for forming PZT or PLZT thinfilms with low defectivity | John B. Robbins | 2019-07-16 |
| 10349526 | Integrated circuit with micro inductor and micro transformer with magnetic core | Byron Lovell Williams, Licheng M. Han | 2019-07-09 |
| 10251280 | Integrated circuit with micro inductor and micro transformer with magnetic core | Byron Lovell Williams, Licheng M. Han | 2019-04-02 |
| 9847223 | Buffer stack for group IIIA-N devices | Qhalid Fareed | 2017-12-19 |
| 9728423 | Piezoelectric thin film process | — | 2017-08-08 |
| 9590086 | Buffer stack for group IIIA-N devices | Qhalid Fareed | 2017-03-07 |
| 9583336 | Process to enable ferroelectric layers on large area substrates | Bhaskar Srinivasan, Brian E. Goodlin, Haowen Bu, Roger C. McDermott | 2017-02-28 |
| 9337023 | Buffer stack for group IIIA-N devices | Qhalid Fareed | 2016-05-10 |
| 9112011 | FET dielectric reliability enhancement | Jungwoo Joh | 2015-08-18 |
| 9005698 | Piezoelectric thin film process | — | 2015-04-14 |
| 8916427 | FET dielectric reliability enhancement | Jungwoo Joh | 2014-12-23 |
| 8907446 | Integrated circuit structure with capacitor and resistor and method for forming | Scott R. Summerfelt, Byron Lovell Williams, Scott Montgomery, James Klawinsky | 2014-12-09 |
| 7960840 | Double wafer carrier process for creating integrated circuit die with through-silicon vias and micro-electro-mechanical systems protected by a hermetic cavity created at the wafer level | Thomas D. Bonifield, Thomas W. Winter, William R. Morrison, Gregory D. Winterton | 2011-06-14 |
| 7601629 | Semiconductive device fabricated using subliming materials to form interlevel dielectrics | Deepak A. Ramappa, Richard L. Guldi, Frank Poag | 2009-10-13 |
| 7396755 | Process and integration scheme for a high sidewall coverage ultra-thin metal seed layer | — | 2008-07-08 |
| 7332425 | Simultaneous deposition and etch process for barrier layer formation in microelectronic device interconnects | Alfred Griffin, Kelly Taylor | 2008-02-19 |
| 7144802 | Vapor deposition of benzotriazole (BTA) for protecting copper interconnects | Changfeng Xia, Arunthathi Sivasothy, Ricky Alan Jackson | 2006-12-05 |
| 6919233 | MIM capacitors and methods for fabricating same | Satyavolu S. Papa Rao, Kelly Taylor, Ed Burke | 2005-07-19 |
| 6803641 | MIM capacitors and methods for fabricating same | Satyavolu S. Papa Rao, Kelly Taylor, Ed Burke | 2004-10-12 |
| 6467490 | Process for using a high nitrogen concentration plasma for fluorine removal from a reactor | Hidenori Kawata | 2002-10-22 |
| 6069095 | Ultra-clean wafer chuck assembly for moisture-sensitive processes conducted in rapid thermal processors | — | 2000-05-30 |