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Method of fabricating non-etch gas cooled epitaxial stack for group IIIA-N devices |
Qhalid Fareed |
2020-01-07 |
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Process for forming PZT or PLZT thinfilms with low defectivity |
John B. Robbins |
2019-07-16 |
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Integrated circuit with micro inductor and micro transformer with magnetic core |
Byron Lovell Williams, Licheng M. Han |
2019-07-09 |
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Integrated circuit with micro inductor and micro transformer with magnetic core |
Byron Lovell Williams, Licheng M. Han |
2019-04-02 |
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Buffer stack for group IIIA-N devices |
Qhalid Fareed |
2017-12-19 |
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Piezoelectric thin film process |
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2017-08-08 |
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Buffer stack for group IIIA-N devices |
Qhalid Fareed |
2017-03-07 |
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Process to enable ferroelectric layers on large area substrates |
Bhaskar Srinivasan, Brian E. Goodlin, Haowen Bu, Roger C. McDermott |
2017-02-28 |
| 9337023 |
Buffer stack for group IIIA-N devices |
Qhalid Fareed |
2016-05-10 |
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FET dielectric reliability enhancement |
Jungwoo Joh |
2015-08-18 |
| 9005698 |
Piezoelectric thin film process |
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2015-04-14 |
| 8916427 |
FET dielectric reliability enhancement |
Jungwoo Joh |
2014-12-23 |
| 8907446 |
Integrated circuit structure with capacitor and resistor and method for forming |
Scott R. Summerfelt, Byron Lovell Williams, Scott Montgomery, James Klawinsky |
2014-12-09 |
| 7960840 |
Double wafer carrier process for creating integrated circuit die with through-silicon vias and micro-electro-mechanical systems protected by a hermetic cavity created at the wafer level |
Thomas D. Bonifield, Thomas W. Winter, William R. Morrison, Gregory D. Winterton |
2011-06-14 |
| 7601629 |
Semiconductive device fabricated using subliming materials to form interlevel dielectrics |
Deepak A. Ramappa, Richard L. Guldi, Frank Poag |
2009-10-13 |
| 7396755 |
Process and integration scheme for a high sidewall coverage ultra-thin metal seed layer |
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2008-07-08 |
| 7332425 |
Simultaneous deposition and etch process for barrier layer formation in microelectronic device interconnects |
Alfred Griffin, Kelly Taylor |
2008-02-19 |
| 7144802 |
Vapor deposition of benzotriazole (BTA) for protecting copper interconnects |
Changfeng Xia, Arunthathi Sivasothy, Ricky Alan Jackson |
2006-12-05 |
| 6919233 |
MIM capacitors and methods for fabricating same |
Satyavolu S. Papa Rao, Kelly Taylor, Ed Burke |
2005-07-19 |
| 6803641 |
MIM capacitors and methods for fabricating same |
Satyavolu S. Papa Rao, Kelly Taylor, Ed Burke |
2004-10-12 |
| 6467490 |
Process for using a high nitrogen concentration plasma for fluorine removal from a reactor |
Hidenori Kawata |
2002-10-22 |
| 6069095 |
Ultra-clean wafer chuck assembly for moisture-sensitive processes conducted in rapid thermal processors |
— |
2000-05-30 |