RJ

Ricky Alan Jackson

TI Texas Instruments: 45 patents #173 of 12,488Top 2%
Overall (All Time): #64,907 of 4,157,543Top 2%
45
Patents All Time

Issued Patents All Time

Showing 25 most recent of 45 patents

Patent #TitleCo-InventorsDate
12087870 Integrated photodetector Debarshi Basu, Henry Litzmann Edwards, Marco A. Gardner 2024-09-10
12054385 Stress isolation using three-dimensional trenches Ting-Ta Yen, Jeronimo SEGOVIA-FERNANDEZ, Benjamin Stassen Cook 2024-08-06
11953460 Monolithic humidity sensor devices and methods of manufacture Wai Lee 2024-04-09
11782102 Hall sensor with dielectric isolation and p-n junction isolation Keith Ryan Green, Erika Lynn Mazotti, William French 2023-10-10
11515266 Methods and apparatus for scribe street probe pads with reduced die chipping during wafer dicing Erika Lynn Mazotti, Sudtida Lavangkul 2022-11-29
11417725 Isolation of circuit elements using front side deep trench etch Dan Carothers, Rajarshi Mukhopadhyay, Ben Cook 2022-08-16
11394361 Buk acoustic wave resonator with guard rings having recessed space from electrode edge and periodic designs Ting-Ta Yen, Brian E. Goodlin, Nicholas Stephen Dellas 2022-07-19
11387782 Stacked-die bulk acoustic wave oscillator package Kurt Peter Wachtler 2022-07-12
11237223 Magnetic flux concentrator for in-plane direction magnetic field concentration Jo Bito, Benjamin Stassen Cook, Dok Won Lee, Keith Ryan Green, William French 2022-02-01
11148939 Stress compensation for piezoelectric optical MEMS devices YungShan Chang, Jeff W. Ritchison, Neng Jiang 2021-10-19
11146230 Method for creating double bragg mirror for tight frequency reference control Nicholas Stephen Dellas, Brian E. Goodlin 2021-10-12
11094837 Integrated photodetector Debarshi Basu, Henry Litzmann Edwards, Marco A. Gardner 2021-08-17
11004929 Trimmable silicon-based thermistor with reduced stress dependence Dok Won Lee, Erika Lynn Mazotti, Mark Visokay, William French, Wai Lee 2021-05-11
10892712 Stacked-die bulk acoustic wave oscillator package Kurt Peter Wachtler 2021-01-12
10854712 Isolation of circuit elements using front side deep trench etch Dan Carothers, Rajarshi Mukhopadhyay, Ben Cook 2020-12-01
10840179 Electronic devices with bond pads formed on a molybdenum layer Ting-Ta Yen, Brian E. Goodlin 2020-11-17
10829365 Piezoelectric optical MEMS device with embedded moisture layers YungShan Chang 2020-11-10
10770406 Methods and apparatus for scribe street pads with reduced die chipping during wafer dicing Erika Lynn Mazotti, Sudtida Lavangkul 2020-09-08
10705159 Highly sensitive, low power fluxgate magnetic sensor integrated onto semiconductor process technologies Erika Lynn Mazotti, Dok Won Lee, William French, Byron J.R. Shulver, Thomas D. Bonifield +1 more 2020-07-07
10651817 Bulk acoustic wave resonator on a stress isolated platform Ting-Ta Yen, Brian E. Goodlin, Nicholas Stephen Dellas 2020-05-12
10574184 Stacked-die bulk acoustic wave oscillator package Kurt Peter Wachtler 2020-02-25
10570006 Infrared sensor design using an epoxy film as an infrared absorption layer Walter B. Meinel, Kalin V. Lazarov, Brian E. Goodlin 2020-02-25
10526198 Infrared sensor design using an epoxy film as an infrared absorption layer Walter B. Meinel, Kalin V. Lazarov, Brian E. Goodlin 2020-01-07
10345397 Highly sensitive, low power fluxgate magnetic sensor integrated onto semiconductor process technologies Erika Lynn Mazotti, Dok Won Lee, William French, Byron J.R. Shulver, Thomas D. Bonifield +1 more 2019-07-09
10276787 Integrated anisotropic magnetoresistive device Dok Won Lee, William French, Fuchao Wang 2019-04-30