CX

Changfeng Xia

TI Texas Instruments: 8 patents #1,843 of 12,488Top 15%
CC Csmc Technologies Fab2 Co.: 6 patents #15 of 208Top 8%
BS Ball Semiconductor: 4 patents #17 of 63Top 30%
Overall (All Time): #213,406 of 4,157,543Top 6%
20
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
12215963 Galvanometer positioning tool and laser printer Che Yin Tang, Yu Chuen Wong, Bojiu Chen, Shufang Wang, Xiumin SONG +1 more 2025-02-04
12022270 MEMS microphone and preparation method therefor Jiale Su, Guoping Zhou, Xinwei Zhang 2024-06-25
11671765 Micro-Electro-Mechanical System device Yonggang Hu, Guoping Zhou 2023-06-06
11402952 Method and circuit for obtaining capacitive feedback signal of capacitive feedback-type micro torsion mirror Wenhui ZHENG, Xiumin SONG, Qiaoming You, Dayong Qiao 2022-08-02
10077188 Manufacturing method of MEMS chip Dan Dai, Xinwei Zhang, Guoping Zhou 2018-09-18
9903884 Parallel plate capacitor and acceleration sensor comprising same Meihan Guo, Xinwei Zhang, Wei Su 2018-02-27
9580301 MEMS chip and manufacturing method therefor Dan Dai, Xinwei Zhang, Guoping Zhou 2017-02-28
9006867 Monitoring structure and monitoring method for silicon wet etching depth Xinwei Zhang, Chengjian Fan, Wei Su 2015-04-14
7550046 Vapor deposition system using benzotriazole (BTA) and isopropyl alcohol for protecting copper interconnects Arunthathi Sivasothy, Ricky Alan Jackson, Asad M. Hauder 2009-06-23
7267726 Method and apparatus for removing polymer residue from semiconductor wafer edge and back side 2007-09-11
7198705 Plating-rinse-plating process for fabricating copper interconnects Linlin Chen, Jiong-Ping Lu 2007-04-03
7195679 Versatile system for wafer edge remediation Trace Hurd 2007-03-27
7144802 Vapor deposition of benzotriazole (BTA) for protecting copper interconnects Arunthathi Sivasothy, Ricky Alan Jackson, Asad Haider 2006-12-05
7067015 Modified clean chemistry and megasonic nozzle for removing backside CMP slurries Linlin Chen 2006-06-27
6784093 Copper surface passivation during semiconductor manufacturing Jiong-Ping Lu 2004-08-31
6743719 Method for forming a conductive copper structure Linlin Chen, Jiong-Ping Lu 2004-06-01
6303517 Fast deposition on spherical-shaped integrated circuits in non-contact CVD process Lixin Wu 2001-10-16
6221165 High temperature plasma-assisted diffusion Yanwei Zhang 2001-04-24
6053123 Plasma-assisted metallic film deposition 2000-04-25
6015464 Film growth system and method for spherical-shaped semiconductor integrated circuits Yanwei Zhang 2000-01-18