Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12215963 | Galvanometer positioning tool and laser printer | Che Yin Tang, Yu Chuen Wong, Bojiu Chen, Shufang Wang, Xiumin SONG +1 more | 2025-02-04 |
| 12022270 | MEMS microphone and preparation method therefor | Jiale Su, Guoping Zhou, Xinwei Zhang | 2024-06-25 |
| 11671765 | Micro-Electro-Mechanical System device | Yonggang Hu, Guoping Zhou | 2023-06-06 |
| 11402952 | Method and circuit for obtaining capacitive feedback signal of capacitive feedback-type micro torsion mirror | Wenhui ZHENG, Xiumin SONG, Qiaoming You, Dayong Qiao | 2022-08-02 |
| 10077188 | Manufacturing method of MEMS chip | Dan Dai, Xinwei Zhang, Guoping Zhou | 2018-09-18 |
| 9903884 | Parallel plate capacitor and acceleration sensor comprising same | Meihan Guo, Xinwei Zhang, Wei Su | 2018-02-27 |
| 9580301 | MEMS chip and manufacturing method therefor | Dan Dai, Xinwei Zhang, Guoping Zhou | 2017-02-28 |
| 9006867 | Monitoring structure and monitoring method for silicon wet etching depth | Xinwei Zhang, Chengjian Fan, Wei Su | 2015-04-14 |
| 7550046 | Vapor deposition system using benzotriazole (BTA) and isopropyl alcohol for protecting copper interconnects | Arunthathi Sivasothy, Ricky Alan Jackson, Asad M. Hauder | 2009-06-23 |
| 7267726 | Method and apparatus for removing polymer residue from semiconductor wafer edge and back side | — | 2007-09-11 |
| 7198705 | Plating-rinse-plating process for fabricating copper interconnects | Linlin Chen, Jiong-Ping Lu | 2007-04-03 |
| 7195679 | Versatile system for wafer edge remediation | Trace Hurd | 2007-03-27 |
| 7144802 | Vapor deposition of benzotriazole (BTA) for protecting copper interconnects | Arunthathi Sivasothy, Ricky Alan Jackson, Asad Haider | 2006-12-05 |
| 7067015 | Modified clean chemistry and megasonic nozzle for removing backside CMP slurries | Linlin Chen | 2006-06-27 |
| 6784093 | Copper surface passivation during semiconductor manufacturing | Jiong-Ping Lu | 2004-08-31 |
| 6743719 | Method for forming a conductive copper structure | Linlin Chen, Jiong-Ping Lu | 2004-06-01 |
| 6303517 | Fast deposition on spherical-shaped integrated circuits in non-contact CVD process | Lixin Wu | 2001-10-16 |
| 6221165 | High temperature plasma-assisted diffusion | Yanwei Zhang | 2001-04-24 |
| 6053123 | Plasma-assisted metallic film deposition | — | 2000-04-25 |
| 6015464 | Film growth system and method for spherical-shaped semiconductor integrated circuits | Yanwei Zhang | 2000-01-18 |