| 12002687 |
System and methods for wafer drying |
Antonio Luis Pacheco Rotondaro, Derek Bassett, Hitoshi Kosugi |
2024-06-04 |
| 11515178 |
System and methods for wafer drying |
Antonio Luis Pacheco Rotondaro, Derek Bassett, Hitoshi Kosugi |
2022-11-29 |
| 11376640 |
Apparatus and method to electrostatically remove foreign matter from substrate surfaces |
Antonio Luis Pacheco Rotondaro, Derek Bassett, Ihsan Simms |
2022-07-05 |
| 10886290 |
Etching of silicon nitride and silica deposition control in 3D NAND structures |
Derek Bassett, Antonio Luis Pacheco Rotondaro, Ihsan Simms |
2021-01-05 |
| 10844332 |
Aqueous cleaning solution and method of protecting features on a substrate during etch residue removal |
Takayuki Toshima, Hiroshi Marumoto, Yoshinori Nishiwaki |
2020-11-24 |
| 8049254 |
Semiconductor device with gate-undercutting recessed region |
Antonio Luis Pacheco Rotondaro, Elisabeth Marley Koontz |
2011-11-01 |
| 7732345 |
Method for using a modified post-etch clean rinsing agent |
Phillip D. Matz |
2010-06-08 |
| 7528072 |
Crystallographic preferential etch to define a recessed-region for epitaxial growth |
Antonio Luis Pacheco Rotondaro, Elisabeth Marley Koontz |
2009-05-05 |
| 7422969 |
Multi-step process for patterning a metal gate electrode |
Antonio Luis Pacheco Rotondaro, Deborah J. Riley |
2008-09-09 |
| 7371691 |
Silicon recess improvement through improved post implant resist removal and cleans |
Lindsey Hall, Deborah J. Riley |
2008-05-13 |
| 7323403 |
Multi-step process for patterning a metal gate electrode |
Antonio Luis Pacheco Rotondaro, Deborah J. Riley |
2008-01-29 |
| 7195679 |
Versatile system for wafer edge remediation |
Changfeng Xia |
2007-03-27 |
| 7132365 |
Treatment of silicon prior to nickel silicide formation |
Sue Crank, Shirin Siddiqui, Deborah J. Riley, Peijun Chen |
2006-11-07 |
| 7037823 |
Method to reduce silanol and improve barrier properties in low k dielectric ic interconnects |
Phillip D. Matz, Sameer Ajmera, Changming Jin |
2006-05-02 |
| 6995088 |
Surface treatment of copper to improve interconnect formation |
Sanjeev Aggarwal, Lindsey Hall |
2006-02-07 |
| 6787425 |
Methods for fabricating transistor gate structures |
Antonio Luis Pacheco Rotondaro, Stephanie W. Butler, Majid Mansoori |
2004-09-07 |
| 6709875 |
Contamination control for embedded ferroelectric device fabrication processes |
Stephen Roy Gilbert, Laura Wills Mirkarimi, Scott R. Summerfelt, Luigi Colombo |
2004-03-23 |