Issued Patents All Time
Showing 1–25 of 80 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12417950 | Mitigating surface damage of probe pads in preparation for direct bonding of a substrate | Guilian Gao, Gaius Gillman Fountain, Jr. | 2025-09-16 |
| 12412808 | Cold plate and manifold integration for high reliability | Ron Zhang, Gaius Gillman Fountain, Jr. | 2025-09-09 |
| 12406975 | Techniques for processing devices | Cyprian Emeka Uzoh, Guilian Gao, Gaius Gillman Fountain, Jr. | 2025-09-02 |
| 12374641 | Sealed bonded structures and methods for forming the same | Rajesh Katkar, Arkalgud R. Sitaram | 2025-07-29 |
| 12341125 | Dimension compensation control for directly bonded structures | Guilian Gao, Gaius Gillman Fountain, Jr., Cyprian Emeka Uzoh | 2025-06-24 |
| 12322677 | Fluid channel geometry optimizations to improve cooling efficiency | Ron Zhang, Gaius Gillman Fountain, Jr., Belgacem Haba, Kyong-Mo Bang, Suhail Jaan Sadiq | 2025-06-03 |
| 12300634 | Protective semiconductor elements for bonded structures | Belgacem Haba, Christopher Aubuchon, Rajesh Katkar | 2025-05-13 |
| 12283490 | Integrated cooling assemblies for advanced device packaging and methods of manufacturing the same | Gaius Gillman Fountain, Jr., Belgacem Haba, George Carlton Hudson, Pawel Mrozek, Suhail Jaan Sadiq | 2025-04-22 |
| 12272677 | Direct bonded stack structures for increased reliability and improved yield in microelectronics | Cyprian Emeka Uzoh, Rajesh Katkar, Thomas Workman, Guilian Gao, Gaius Gillman Fountain, Jr. +3 more | 2025-04-08 |
| 12266545 | Structures and methods for integrated cold plate in XPUs and memory | Gaius Gillman Fountain, Jr., Belgacem Haba | 2025-04-01 |
| 12261099 | Embedded cooling systems with coolant channel for device packaging | Guilian Gao, Belgacem Haba | 2025-03-25 |
| 12205926 | TSV as pad | Guilian Gao, Bongsub Lee, Gaius Gillman Fountain, Jr., Cyprian Emeka Uzoh, Belgacem Haba +1 more | 2025-01-21 |
| 12176264 | Manifold designs for embedded liquid cooling in a package | Belgacem Haba, Gaius Gillman Fountain, Jr., Ron Zhang, Rajesh Katkar | 2024-12-24 |
| 12136605 | Layer structures for making direct metal-to-metal bonds at low temperatures in microelectronics and method for forming the same | Guilian Gao, Gaius Gillman Fountain, Jr., Rajesh Katkar, Ilyas Mohammed, Cyprian Emeka Uzoh | 2024-11-05 |
| 12132020 | Low temperature bonded structures | Cyprian Emeka Uzoh, Jeremy Alfred Theil, Rajesh Katkar, Guilian Gao | 2024-10-29 |
| 12100676 | Low temperature bonded structures | Cyprian Emeka Uzoh, Jeremy Alfred Theil, Rajesh Katkar, Guilian Gao | 2024-09-24 |
| 12080672 | Direct gang bonding methods including directly bonding first element to second element to form bonded structure without adhesive | Belgacem Haba, Javier A. Delacruz, Rajesh Katkar, Cyprian Emeka Uzoh, Guilian Gao +1 more | 2024-09-03 |
| 12068278 | Processed stacked dies | Cyprian Emeka Uzoh, Guilian Gao, Gaius Gillman Fountain, Jr. | 2024-08-20 |
| 12051621 | Microelectronic assembly from processed substrate | Cyprian Emeka Uzoh | 2024-07-30 |
| 12046571 | Low temperature bonded structures | Cyprian Emeka Uzoh, Jeremy Alfred Theil, Liang Wang, Rajesh Katkar, Guilian Gao | 2024-07-23 |
| 12009338 | Dimension compensation control for directly bonded structures | Guilian Gao, Gaius Gillman Fountain, Jr., Cyprian Emeka Uzoh | 2024-06-11 |
| 11978681 | Mitigating surface damage of probe pads in preparation for direct bonding of a substrate | Guilian Gao, Gaius Gillman Fountain, Jr. | 2024-05-07 |
| 11955445 | Metal pads over TSV | Guilian Gao, Bongsub Lee, Gaius Gillman Fountain, Jr., Cyprian Emeka Uzoh, Belgacem Haba +1 more | 2024-04-09 |
| 11955393 | Structures for bonding elements including conductive interface features | Rajesh Katkar, Bongsub Lee, Gaius Gillman Fountain, Jr., Cyprian Emeka Uzoh | 2024-04-09 |
| 11955463 | Direct bonded stack structures for increased reliability and improved yield in microelectronics | Cyprian Emeka Uzoh, Rajesh Katkar, Thomas Workman, Guilian Gao, Gaius Gillman Fountain, Jr. +3 more | 2024-04-09 |