Issued Patents All Time
Showing 1–25 of 46 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12381173 | Direct hybrid bonding of substrates having microelectronic components with different profiles and/or pitches at the bonding interface | Gaius Gillman Fountain, Jr., Chandrasekhar Mandalapu, Cyprian Emeka Uzoh | 2025-08-05 |
| 12341018 | Method for preparing a surface for direct-bonding | — | 2025-06-24 |
| 12266640 | Molded direct bonded and interconnected stack | Guilian Gao, Cyprian Emeka Uzoh, Belgacem Haba, Rajesh Katkar | 2025-04-01 |
| 12132020 | Low temperature bonded structures | Cyprian Emeka Uzoh, Rajesh Katkar, Guilian Gao, Laura Wills Mirkarimi | 2024-10-29 |
| 12125784 | Interconnect structures | Cyprian Emeka Uzoh, Gaius Gillman Fountain, Jr. | 2024-10-22 |
| 12100676 | Low temperature bonded structures | Cyprian Emeka Uzoh, Rajesh Katkar, Guilian Gao, Laura Wills Mirkarimi | 2024-09-24 |
| 12046571 | Low temperature bonded structures | Cyprian Emeka Uzoh, Liang Wang, Rajesh Katkar, Guilian Gao, Laura Wills Mirkarimi | 2024-07-23 |
| 11837582 | Molded direct bonded and interconnected stack | Guilian Gao, Cyprian Emeka Uzoh, Belgacem Haba, Rajesh Katkar | 2023-12-05 |
| 11804377 | Method for preparing a surface for direct-bonding | — | 2023-10-31 |
| 11764189 | Molded direct bonded and interconnected stack | Guilian Gao, Cyprian Emeka Uzoh, Belgacem Haba, Rajesh Katkar | 2023-09-19 |
| 11756880 | Interconnect structures | Cyprian Emeka Uzoh, Gaius Gillman Fountain, Jr. | 2023-09-12 |
| 11552041 | Chemical mechanical polishing for hybrid bonding | Gaius Gillman Fountain, Jr., Chandrasekhar Mandalapu, Cyprian Emeka Uzoh | 2023-01-10 |
| 11515279 | Low temperature bonded structures | Cyprian Emeka Uzoh, Liang Wang, Rajesh Katkar, Guilian Gao, Laura Wills Mirkarimi | 2022-11-29 |
| 11244916 | Low temperature bonded structures | Cyprian Emeka Uzoh, Rajesh Katkar, Guilian Gao, Laura Wills Mirkarimi | 2022-02-08 |
| 11158573 | Interconnect structures | Cyprian Emeka Uzoh, Gaius Gillman Fountain, Jr. | 2021-10-26 |
| 11158606 | Molded direct bonded and interconnected stack | Guilian Gao, Cyprian Emeka Uzoh, Belgacem Haba, Rajesh Katkar | 2021-10-26 |
| 11056348 | Bonding surfaces for microelectronics | — | 2021-07-06 |
| 10840205 | Chemical mechanical polishing for hybrid bonding | Gaius Gillman Fountain, Jr., Chandrasekhar Mandalapu, Cyprian Emeka Uzoh | 2020-11-17 |
| 10790262 | Low temperature bonded structures | Cyprian Emeka Uzoh, Liang Wang, Rajesh Katkar, Guilian Gao, Laura Wills Mirkarimi | 2020-09-29 |
| 7939022 | Integration of colorimetric transducers and detector | — | 2011-05-10 |
| 7152758 | Scented material dispense system for a hand-held device | Ronald Fazzio, Richard C. Ruby, Kevin Killeen, Daniel Roitman | 2006-12-26 |
| 7096716 | Integration of thermal regulation and electronic fluid sensing | — | 2006-08-29 |
| 6902946 | Simplified upper electrode contact structure for PIN diode active pixel sensor | — | 2005-06-07 |
| 6786968 | Method for low temperature photonic crystal structures | — | 2004-09-07 |
| 6759262 | Image sensor with pixel isolation system and manufacturing method therefor | Dietrich W. Vook, Homayoon Haddad | 2004-07-06 |