Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12406959 | Post CMP processing for hybrid bonding | Gaius Gillman Fountain, Jr., Guilian Gao | 2025-09-02 |
| 12381173 | Direct hybrid bonding of substrates having microelectronic components with different profiles and/or pitches at the bonding interface | Gaius Gillman Fountain, Jr., Cyprian Emeka Uzoh, Jeremy Alfred Theil | 2025-08-05 |
| 12300662 | DBI to SI bonding for simplified handle wafer | Gaius Gillman Fountain, Jr., Guilian Gao | 2025-05-13 |
| 11862215 | Access line having a resistive layer for memory cell access | Sateesh Talasila, Robert Cassel, Sundaravadivel Rajarajan, Iniyan Soundappa Elango, Srivatsan Venkatesan | 2024-01-02 |
| 11791307 | DBI to SI bonding for simplified handle wafer | Gaius Gillman Fountain, Jr., Guilian Gao | 2023-10-17 |
| 11664357 | Techniques for joining dissimilar materials in microelectronics | Gaius Gillman Fountain, Jr., Laura Wills Mirkarimi | 2023-05-30 |
| 11552041 | Chemical mechanical polishing for hybrid bonding | Gaius Gillman Fountain, Jr., Cyprian Emeka Uzoh, Jeremy Alfred Theil | 2023-01-10 |
| 10964664 | DBI to Si bonding for simplified handle wafer | Gaius Gillman Fountain, Jr., Guilian Gao | 2021-03-30 |
| 10840205 | Chemical mechanical polishing for hybrid bonding | Gaius Gillman Fountain, Jr., Cyprian Emeka Uzoh, Jeremy Alfred Theil | 2020-11-17 |