Issued Patents All Time
Showing 51–75 of 80 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9887166 | Integrated circuit assemblies with reinforcement frames, and methods of manufacture | Rajesh Katkar, Arkalgud R. Sitaram, Charles G. Woychik | 2018-02-06 |
| 9847238 | Fan-out wafer-level packaging using metal foil lamination | Xuan Li, Rajesh Katkar, Long Huynh, Bongsub Lee, Gabriel Z. Guevara +3 more | 2017-12-19 |
| 9769923 | Interposers | Bong-Sub Lee, Cyprian Emeka Uzoh, Charles G. Woychik, Liang Wang, Arkalgud R. Sitaram | 2017-09-19 |
| 9691679 | Method for package-on-package assembly with wire bonds to encapsulation surface | Reynaldo Co | 2017-06-27 |
| 9646946 | Fan-out wafer-level packaging using metal foil lamination | Xuan Li, Rajesh Katkar, Long Huynh, Bongsub Lee, Gabriel Z. Guevara +3 more | 2017-05-09 |
| 9583426 | Multi-layer substrates suitable for interconnection between circuit modules | Hong Shen, Liang Wang, Gabriel Z. Guevara, Rajesh Katkar, Cyprian Emeka Uzoh | 2017-02-28 |
| 9570385 | Method for fabrication of interconnection circuitry with electrically conductive features passing through a support and comprising core portions formed using nanoparticle-containing inks | Bong-Sub Lee, Cyprian Emeka Uzoh, Charles G. Woychik, Liang Wang, Arkalgud R. Sitaram | 2017-02-14 |
| 9543277 | Wafer level packages with mechanically decoupled fan-in and fan-out areas | Bongsub Lee, Tu Tam Vu, Rajesh Katkar, Akash Agrawal, Kyong-Mo Bang +3 more | 2017-01-10 |
| 9502372 | Wafer-level packaging using wire bond wires in place of a redistribution layer | Rajesh Katkar, Tu Tam Vu, Bongsub Lee, Kyong-Mo Bang, Xuan Li +4 more | 2016-11-22 |
| 9496236 | Interconnect structure | Debabrata Gupta, Yukio Hashimoto, Ilyas Mohammed, Rajesh Katkar | 2016-11-15 |
| 9355997 | Integrated circuit assemblies with reinforcement frames, and methods of manufacture | Rajesh Katkar, Arkalgud R. Sitaram, Charles G. Woychik | 2016-05-31 |
| 9349706 | Method for package-on-package assembly with wire bonds to encapsulation surface | Reynaldo Co | 2016-05-24 |
| 9048234 | Off-chip vias in stacked chips | Belgacem Haba, Ilyas Mohammed, Vage Oganesian, David Ovrutsky | 2015-06-02 |
| 8883562 | Reconstituted wafer stack packaging with after-applied pad extensions | Belgacem Haba, Giles Humpston, David Ovrutsky | 2014-11-11 |
| 8853558 | Interconnect structure | Debabrata Gupta, Yukio Hashimoto, Ilyas Mohammed, Rajesh Katkar | 2014-10-07 |
| 8772152 | Method for package-on-package assembly with wire bonds to encapsulation surface | Reynaldo Co | 2014-07-08 |
| 8680662 | Wafer level edge stacking | Belgacem Haba, Ilyas Mohammed, Moshe Kriman | 2014-03-25 |
| 8476774 | Off-chip VIAS in stacked chips | Belgacem Haba, Ilyas Mohammed, Vage Oganesian, David Ovrutsky | 2013-07-02 |
| 8461672 | Reconstituted wafer stack packaging with after-applied pad extensions | Belgacem Haba, Giles Humpston, David Ovrutsky | 2013-06-11 |
| 8372741 | Method for package-on-package assembly with wire bonds to encapsulation surface | Reynaldo Co | 2013-02-12 |
| 8076788 | Off-chip vias in stacked chips | Belgacem Haba, Ilyas Mohammed, Vage Oganesian, David Ovrutsky | 2011-12-13 |
| 7901989 | Reconstituted wafer level stacking | Belgacem Haba, Ilyas Mohammed, Vage Oganesian, David Ovrutsky | 2011-03-08 |
| 7489846 | Photonic crystal sensors | Annette Grot, Kai Chow, Mihail Sigalas | 2009-02-10 |
| 7196017 | Method for etching smooth sidewalls in III-V based compounds for electro-optical devices | Kai Chow | 2007-03-27 |
| 6993234 | Photonic crystal resonator apparatus with improved out of plane coupling | Mihail Sigalas, Annette Grot | 2006-01-31 |