Issued Patents All Time
Showing 1–25 of 46 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10249673 | Rear-face illuminated solid state image sensors | Moshe Kriman | 2019-04-02 |
| 10147750 | Optical imaging apparatus and methods of making the same | Moshe Kriman, William Hudson Welch, Osher Avsian, Felix Hazanovich, Ekaterina Axelrod | 2018-12-04 |
| 9548145 | Microelectronic assembly with multi-layer support structure | Michael J. Nystrom | 2017-01-17 |
| 9484379 | Rear-face illuminated solid state image sensors | Moshe Kriman | 2016-11-01 |
| 9029759 | Compact camera modules with features for reducing Z-height and facilitating lens alignment and methods for manufacturing the same | Harpuneet Singh, Ellis Chau, Eddie Alex Azuma, Peter Pietrangelo, Ocie Ward | 2015-05-12 |
| 8900910 | Rear-face illuminated solid state image sensors | Moshe Kriman | 2014-12-02 |
| 8883562 | Reconstituted wafer stack packaging with after-applied pad extensions | Belgacem Haba, David Ovrutsky, Laura Wills Mirkarimi | 2014-11-11 |
| 8735287 | Semiconductor packaging process using through silicon vias | Belgacem Haba, Moti Margalit | 2014-05-27 |
| 8624342 | Rear-face illuminated solid state image sensors | Moshe Kriman | 2014-01-07 |
| 8604605 | Microelectronic assembly with multi-layer support structure | Michael J. Nystrom | 2013-12-10 |
| 8551815 | Stack packages using reconstituted wafers | Osher Avsian, Andrey Grinman, Moti Margalit | 2013-10-08 |
| 8545599 | Electrohydrodynamic device components employing solid solutions | — | 2013-10-01 |
| 8466542 | Stacked microelectronic assemblies having vias extending through bond pads | Moshe Kriman, Osher Avsian, Belgacem Haba, Dmitri Burshtyn | 2013-06-18 |
| 8461672 | Reconstituted wafer stack packaging with after-applied pad extensions | Belgacem Haba, David Ovrutsky, Laura Wills Mirkarimi | 2013-06-11 |
| 8241959 | Microelectronic packages fabricated at the wafer level and methods therefor | Belgacem Haba | 2012-08-14 |
| 8207604 | Microelectronic package comprising offset conductive posts on compliant layer | Belgacem Haba, Masud Beroz, Jae M. Park | 2012-06-26 |
| 8193615 | Semiconductor packaging process using through silicon vias | Belgacem Haba, Moti Margalit | 2012-06-05 |
| 7935568 | Wafer-level fabrication of lidded chips with electrodeposited dielectric coating | Vage Oganesian, David Ovrutsky, Charles Rosenstein, Belgacem Haba | 2011-05-03 |
| 7936062 | Wafer level chip packaging | Michael J. Nystrom, Vage Oganesian, Yulia Aksenton, Osher Avsian, Robert Burtzlaff +7 more | 2011-05-03 |
| 7858445 | Wire bonded wafer level cavity package | Kenneth Honer, David B. Tuckerman, Michael J. Nystrom | 2010-12-28 |
| 7793414 | Methods for forming connection structures for microelectronic devices | Belgacem Haba, Masud Beroz, David B. Tuckerman, Richard Dewitt Crisp | 2010-09-14 |
| 7768574 | Compact lens turret assembly | — | 2010-08-03 |
| 7759166 | Microelectronic packages fabricated at the wafer level and methods therefor | Belgacem Haba | 2010-07-20 |
| 7719121 | Microelectronic packages and methods therefor | Guilian Gao, Belgacem Haba | 2010-05-18 |
| 7593636 | Pin referenced image sensor to reduce tilt in a camera module | Michael J. Nystrom, David B. Tuckerman, Belgacem Haba, Jesse Thompson | 2009-09-22 |