Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12285794 | Hot stamping component and method of manufacturing the same | Je Youl Kong, Kye Jeong Park, Seung Chae Yoon | 2025-04-29 |
| 8641913 | Fine pitch microcontacts and method for forming thereof | Belgacem Haba, Yoichi Kubota, Teck-Gyu Kang | 2014-02-04 |
| 8604348 | Method of making a connection component with posts and pads | Yoichi Kubota, Teck-Gyu Kang, Belgacem Haba | 2013-12-10 |
| 8207604 | Microelectronic package comprising offset conductive posts on compliant layer | Belgacem Haba, Masud Beroz, Giles Humpston | 2012-06-26 |
| 8046912 | Method of making a connection component with posts and pads | Yoichi Kubota, Teck-Gyu Kang, Belgacem Haba | 2011-11-01 |
| 7763983 | Stackable microelectronic device carriers, stacked device carriers and methods of making the same | Kenneth Honer | 2010-07-27 |
| 7659617 | Substrate for a flexible microelectronic assembly and a method of fabricating thereof | Teck-Gyu Kang, Yoichi Kubota | 2010-02-09 |
| 7495179 | Components with posts and pads | Yoichi Kubota, Teck-Gyu Kang, Belgacem Haba | 2009-02-24 |
| 7397068 | Solid state lighting device | Teck-Gyu Kang | 2008-07-08 |
| 7368695 | Image sensor package and fabrication method | Teck-Gyu Kang, Michael Estrella, Kenneth R. Thompson, Craig Mitchell, Belgacem Haba | 2008-05-06 |
| 7304376 | Microelectronic assemblies with springs | Belgacem Haba, Teck-Gyu Kang, Nicholas Colella | 2007-12-04 |
| 7268304 | Microelectronic connection components having bondable wires | Masud Beroz, Belgacem Haba, Fion Tan, Philip R. Osborn | 2007-09-11 |
| 7176506 | High frequency chip packages with connecting elements | Masud Beroz, Michael Warner, Lee Smith, Glenn Urbish, Teck-Gyu Kang +1 more | 2007-02-13 |
| 7053485 | Microelectronic packages with self-aligning features | Kyong-Mo Bang, Teck-Gyu Kang | 2006-05-30 |