Issued Patents All Time
Showing 25 most recent of 77 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10847469 | CTE compensation for wafer-level and chip-scale packages and assemblies | Kenneth Vanhille, Aaron C. Caba, Jared W. Jordan, Timothy Amis Smith, Anatoliy O. Boryssenko +1 more | 2020-11-24 |
| 10748858 | High yield substrate assembly | Liang Wang, Ilyas Mohammed | 2020-08-18 |
| 10396041 | High yield substrate assembly | Liang Wang, Ilyas Mohammed | 2019-08-27 |
| 10128601 | Fluid pressure activated electrical contact devices and methods | — | 2018-11-13 |
| 10003149 | Fluid pressure activated electrical contact devices and methods | — | 2018-06-19 |
| 9947643 | Inverted optical device | Ilyas Mohammed, Liang Wang | 2018-04-17 |
| 9842745 | Heat spreading substrate with embedded interconnects | Ilyas Mohammed | 2017-12-12 |
| 9805891 | Multiplexing, switching and testing devices and methods using fluid pressure | — | 2017-10-31 |
| 9583671 | Quantum efficiency of multiple quantum wells | Liang Wang, Ilyas Mohammed | 2017-02-28 |
| 9577358 | Fluid pressure activated electrical contact devices and methods | — | 2017-02-21 |
| 9570416 | Stacked packaging improvements | Belgacem Haba, Craig Mitchell | 2017-02-14 |
| 9293641 | Inverted optical device | Ilyas Mohammed, Liang Wang | 2016-03-22 |
| 9153562 | Stacked packaging improvements | Belgacem Haba, Craig Mitchell | 2015-10-06 |
| 8975616 | Quantum efficiency of multiple quantum wells | Liang Wang, Ilyas Mohammed | 2015-03-10 |
| 8963013 | Three dimensional interposer device | — | 2015-02-24 |
| 8946757 | Heat spreading substrate with embedded interconnects | Ilyas Mohammed | 2015-02-03 |
| 8927337 | Stacked packaging improvements | Belgacem Haba, Craig Mitchell | 2015-01-06 |
| 8912024 | Front facing piggyback wafer assembly | Ilyas Mohammed, Liang Wang | 2014-12-16 |
| 8900974 | High yield substrate assembly | Liang Wang, Ilyas Mohammed | 2014-12-02 |
| 8841204 | High yield substrate assembly | Liang Wang, Ilyas Mohammed | 2014-09-23 |
| 8531020 | Stacked packaging improvements | Belgacem Haba, Craig Mitchell | 2013-09-10 |
| 8525314 | Stacked packaging improvements | Belgacem Haba, Craig Mitchell | 2013-09-03 |
| 8329581 | Microelectronic packages and methods therefor | Belgacem Haba, Teck-Gyu Kang, Yoichi Kubota, Sridhar Krishnan, John Riley +1 more | 2012-12-11 |
| 8207604 | Microelectronic package comprising offset conductive posts on compliant layer | Belgacem Haba, Giles Humpston, Jae M. Park | 2012-06-26 |
| 8039363 | Small chips with fan-out leads | Belgacem Haba | 2011-10-18 |