Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10847469 | CTE compensation for wafer-level and chip-scale packages and assemblies | Kenneth Vanhille, Masud Beroz, Jared W. Jordan, Timothy Amis Smith, Anatoliy O. Boryssenko +1 more | 2020-11-24 |
| 8952304 | Rocket nozzle assembly | Joseph Bellotte, Thomas F. Farabaugh | 2015-02-10 |