Issued Patents All Time
Showing 1–25 of 44 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11830845 | Package-on-package assembly with wire bonds to encapsulation surface | Hiroaki Sato, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang, Ellis Chau +6 more | 2023-11-28 |
| 11424211 | Package-on-package assembly with wire bonds to encapsulation surface | Hiroaki Sato, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang, Ellis Chau +6 more | 2022-08-23 |
| 10833044 | Package-on-package assembly with wire bonds to encapsulation surface | Hiroaki Sato, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang, Ellis Chau +6 more | 2020-11-10 |
| 10593643 | Package-on-package assembly with wire bonds to encapsulation surface | Hiroaki Sato, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang, Ellis Chau +6 more | 2020-03-17 |
| 10062661 | Package-on-package assembly with wire bonds to encapsulation surface | Hiroaki Sato, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang, Ellis Chau +6 more | 2018-08-28 |
| 10032695 | Powermap optimized thermally aware 3D chip package | Madhu Krishnan Iyengar, Christopher G. Malone, Norman Paul Jouppi | 2018-07-24 |
| 9984901 | Method for making a microelectronic assembly having conductive elements | Belgacem Haba, Ilyas Mohammed, Ellis Chau | 2018-05-29 |
| 9716075 | Semiconductor chip assembly and method for making same | Wei-Shun Wang, Hiroaki Sato, Kiyoaki Hashimoto, Yoshikuni Nakadaira, Norihito Masuda +3 more | 2017-07-25 |
| 9691731 | Package-on-package assembly with wire bonds to encapsulation surface | Hiroaki Sato, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang, Ellis Chau +6 more | 2017-06-27 |
| 9224717 | Package-on-package assembly with wire bonds to encapsulation surface | Hiroaki Sato, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang, Ellis Chau +6 more | 2015-12-29 |
| 9218988 | Microelectronic packages and methods therefor | Belgacem Haba, Ilyas Mohammed, Ellis Chau | 2015-12-22 |
| 9137903 | Semiconductor chip assembly and method for making same | Wei-Shun Wang, Hiroaki Sato, Kiyoaki Hashimoto, Yoshikuni Nakadaira, Norihito Masuda +3 more | 2015-09-15 |
| 9093435 | Package-on-package assembly with wire bonds to encapsulation surface | Hiroaki Sato, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang, Ellis Chau +6 more | 2015-07-28 |
| 9054023 | Flip chip overmold package | — | 2015-06-09 |
| 8728865 | Microelectronic packages and methods therefor | Belgacem Haba, Ilyas Mohammed, Ellis Chau | 2014-05-20 |
| 8710643 | Electronic package with fluid flow barriers | Yuan-Liang Li, Yuanlin Xie | 2014-04-29 |
| 8641913 | Fine pitch microcontacts and method for forming thereof | Belgacem Haba, Yoichi Kubota, Jae M. Park | 2014-02-04 |
| 8618659 | Package-on-package assembly with wire bonds to encapsulation surface | Hiroaki Sato, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang, Ellis Chau +6 more | 2013-12-31 |
| 8604348 | Method of making a connection component with posts and pads | Yoichi Kubota, Jae M. Park, Belgacem Haba | 2013-12-10 |
| 8531039 | Micro pin grid array with pin motion isolation | Philip Damberg, Belgacem Haba, David B. Tuckerman | 2013-09-10 |
| 8415809 | Flip chip overmold package | — | 2013-04-09 |
| 8378487 | Wafer level chip package and a method of fabricating thereof | Belgacem Haba, Guilian Gao | 2013-02-19 |
| 8329581 | Microelectronic packages and methods therefor | Belgacem Haba, Masud Beroz, Yoichi Kubota, Sridhar Krishnan, John Riley +1 more | 2012-12-11 |
| 8133808 | Wafer level chip package and a method of fabricating thereof | Belgacem Haba, Guilian Gao | 2012-03-13 |
| 8125066 | Package on package configurations with embedded solder balls and interposal layer | — | 2012-02-28 |