Issued Patents All Time
Showing 1–25 of 100 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12293956 | Boiling enhancement structures for immersion cooled electronic systems | Jin Yang, Jimmy Chuang, Xicai Jing, Yuyang XIA, David Shia +9 more | 2025-05-06 |
| 12119260 | Methods for manufacturing semiconductor structures including isolation layer and semiconductor structures including isolation layer | — | 2024-10-15 |
| 11887854 | Semiconductor structure manufacturing method and two semiconductor structures | — | 2024-01-30 |
| 11259399 | Socket with thermal conductor | Hongfei Yan, Leo Liu, Chunlei Guo | 2022-02-22 |
| 11257935 | Gan rectifier suitable for operating under 35GHZ alternating-current frequency, and preparation method therefor | Wenliang Wang, Guoqiang Li, Xiaochan Li | 2022-02-22 |
| 10978564 | Semiconductor device and method of manufacturing the same | — | 2021-04-13 |
| 10439029 | Field plate power device and method of manufacturing the same | Yi Pei, Feihang Liu | 2019-10-08 |
| 10103219 | Power semiconductor device and method for manufacturing the same | Yi Pei, Chuanjia Wu | 2018-10-16 |
| 10084486 | High speed turbo decoder | Jianbin Zhu, Yi ZHOU, Yuzhou Zhang, Chuong Vu | 2018-09-25 |
| 10068974 | Field plate power device and method of manufacturing the same | Yi Pei, Feihang Liu | 2018-09-04 |
| 9577031 | Semiconductor structure and method for forming the same | Lei Guo | 2017-02-21 |
| 9330997 | Heat spreading structures for integrated circuits | Ken Beng Lim, Myung June Lee, Ping Chet Tan | 2016-05-03 |
| 9312427 | Semiconductor structure and method for forming the same | Lei Guo | 2016-04-12 |
| 9230874 | Integrated circuit package with a heat conductor | — | 2016-01-05 |
| 9196575 | Integrated circuit package with cavity in substrate | Myung June Lee, Yuanlin Xie | 2015-11-24 |
| 9131603 | Signal line pairs on a circuit board which are displaced from each other relative to a center line | Kai Xiao, Jimmy Hsu, Richard K. Kunze | 2015-09-08 |
| 8996948 | Methods, systems, and apparatus for tail termination of turbo decoding | Jianbin Zhu, Tao Zhang | 2015-03-31 |
| 8930791 | Early stop method and apparatus for turbo decoding | Jianbin Zhu, Tao Zhang | 2015-01-06 |
| 8918695 | Methods and apparatus for early stop algorithm of turbo decoding | Jianbin Zhu, Tao Zhang | 2014-12-23 |
| 8839081 | Rate matching and de-rate matching on digital signal processors | Julien Nicolas, Jianbin Zhu | 2014-09-16 |
| 8819517 | Systems and methods for a turbo decoder in a universal mobile telecommunication system (UMTS) | Tao Zhang, Jianbin Zhu | 2014-08-26 |
| 8806290 | Systems and methods for parallel dual-mode turbo decoders | Tao Zhang, Jianbin Zhu | 2014-08-12 |
| 8806310 | Rate matching and de-rate matching on digital signal processors | Julien Nicolas, Jianbin Zhu | 2014-08-12 |
| 8710643 | Electronic package with fluid flow barriers | Teck-Gyu Kang, Yuanlin Xie | 2014-04-29 |
| 8212353 | Structure and assembly procedure for low stress thin die flip chip packages designed for low-K Si and thin core substrate | Wen-chou Vincent Wang, Bruce Euzent, Vadali Mahadev | 2012-07-03 |