Issued Patents All Time
Showing 25 most recent of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12315780 | Technologies for processor loading mechanisms | Ralph V. Miele, Phil Geng, Mengqi Liu, Sandeep Ahuja, Eric W. Buddrius +1 more | 2025-05-27 |
| 12309933 | Magnetically secured semiconductor chip package loading assembly | Phil Geng, Timothy Glen Hanna, Xiaoning Ye, Sandeep Ahuja, Jacob McMillian +2 more | 2025-05-20 |
| 12309966 | Thermally conductive chamber with stiffening structure for thermal cooling assembly of semiconductor chip package under high loading force | Jin Yang, Jimmy Chuang, Mengqi Liu, Phil Geng, Ralph V. Miele +1 more | 2025-05-20 |
| 12293956 | Boiling enhancement structures for immersion cooled electronic systems | Jin Yang, Jimmy Chuang, Xicai Jing, Yuan-Liang Li, Yuyang XIA +9 more | 2025-05-06 |
| 12279395 | Patterned bolster plate and composite back plate for semiconductor chip LGA package and cooling assembly retention | Phil Geng, Ralph V. Miele, Jeffory L. Smalley, Eric W. Buddrius, Sean T. Sivapalan +2 more | 2025-04-15 |
| 12262478 | Selectively applied protective layer on exposed materials of electronic circuit board and electronic components disposed thereon for immersion bath cooled systems | Jin Yang | 2025-03-25 |
| 12248344 | Technologies for liquid cooling interfaces | Kristin L. Weldon, David Rodriguez, Jin Yang, Jimmy Chuang, Mohanraj Prabhugoud +1 more | 2025-03-11 |
| 12133357 | Cold plate architecture for liquid cooling of devices | Jin Yang, Mohanraj Prabhugoud, Olaotan ELENITOBA-JOHNSON, Craig Jahne, Phil Geng | 2024-10-29 |
| 12131977 | Electronic systems with inverted circuit board with heat sink to chassis attachment | Barrett M. Faneuf, Phil Geng, Kenan Arik, Casey Winkel, Sandeep Ahuja +9 more | 2024-10-29 |
| 12063759 | Conformable cold plate for fluid cooling applications | Berhanu Wondimu, Xudong Tang | 2024-08-13 |
| 12057370 | Vacuum modulated two phase cooling loop efficiency and parallelism enhancement | Paul Diglio, Pooya Tadayon | 2024-08-06 |
| 11976671 | Vacuum modulated two phase cooling loop performance enhancement | Paul Diglio, Pooya Tadayon | 2024-05-07 |
| 11842943 | Electronic systems with inverted circuit board with heat sink to chassis attachment | Barrett M. Faneuf, Phil Geng, Kenan Arik, Casey Winkel, Sandeep Ahuja +9 more | 2023-12-12 |
| 11449111 | Scalable, high load, low stiffness, and small footprint loading mechanism | Eric W. Buddrius, Ralph V. Miele, Mohanraj Prabhugoud, Jeffory L. Smalley | 2022-09-20 |
| 11262384 | Fine pitch probe card methods and systems | Pooya Tadayon | 2022-03-01 |
| 10677845 | Converged test platforms and processes for class and system testing of integrated circuits | Abram M. Detofsky, Evan M. Fledell, Mustapha Amadu Abdulai, John M. Peterson, Dinia P. Kitendaugh +2 more | 2020-06-09 |
| 10595439 | Movable heatsink utilizing flexible heat pipes | Evan A. Chenelly, Mohanraj Prabhugoud | 2020-03-17 |
| 9977054 | Etching for probe wire tips for microelectronic device test | Todd P. Albertson, David Craig, Joseph D. Stanford | 2018-05-22 |
| 9535095 | Anti-rotation for wire probes in a probe head of a die tester | Todd P. Albertson, Keith J. Martin | 2017-01-03 |
| 9366482 | Adjustable heat pipe thermal unit | Jin Yang | 2016-06-14 |
| 9354273 | Composite wire probe test assembly | Kip P. Stevenson, Todd P. Albertson, Kamil Salloum | 2016-05-31 |
| 9279830 | Test probe structures and methods including positioning test probe structures in a test head | Roy E. Swart, Warren S. Crippen, Charlotte C. Kwong | 2016-03-08 |
| 9255945 | Micro positioning test socket and methods for active precision alignment and co-planarity feedback | Abram M. Detofsky, Todd P. Albertson | 2016-02-09 |
| 9207258 | Composite wire probes for testing integrated circuits | Todd P. Albertson, Kip P. Stevenson | 2015-12-08 |
| 9134343 | Sort probe gripper | Todd P. Albertson | 2015-09-15 |