| 12500137 |
Directly impinging pressure modulated spray cooling and methods of target temperature control |
Prabhakar Subrahmanyam, Tewodros Fiseha Wondimu, Ying-Feng PANG, Muhammad Waseem Ahmad, Paul Diglio +1 more |
2025-12-16 |
|
| 12490410 |
Circuit devices integrated with boiling enhancement for two-phase immersion cooling |
Jin Yang, Jimmy Chuang, Mohanraj Prabjugoud, Michael T. Crocker |
2025-12-02 |
|
| 12453054 |
Cooling assembly with strap element to diminish lateral movement of cooling mass during installation of the cooling mass |
Phil Geng, Ralph V. Miele, Sandeep Ahuja, Jeffory L. Smalley |
2025-10-21 |
|
| 12442712 |
Liquid cooling system leak detection improvements |
Prabhakar Subrahmanyam, Yingbo Xia, Ying-Feng PANG, Victor Polyanko, Mark Lawrence Bianco +27 more |
2025-10-14 |
|
| 12315780 |
Technologies for processor loading mechanisms |
Ralph V. Miele, Phil Geng, Mengqi Liu, Sandeep Ahuja, Eric W. Buddrius +1 more |
2025-05-27 |
|
| 12309933 |
Magnetically secured semiconductor chip package loading assembly |
Phil Geng, Timothy Glen Hanna, Xiaoning Ye, Sandeep Ahuja, Jacob McMillian +2 more |
2025-05-20 |
|
| 12309966 |
Thermally conductive chamber with stiffening structure for thermal cooling assembly of semiconductor chip package under high loading force |
Jin Yang, Jimmy Chuang, Mengqi Liu, Phil Geng, Ralph V. Miele +1 more |
2025-05-20 |
|
| 12293956 |
Boiling enhancement structures for immersion cooled electronic systems |
Jin Yang, Jimmy Chuang, Xicai Jing, Yuan-Liang Li, Yuyang XIA +9 more |
2025-05-06 |
|
| 12279395 |
Patterned bolster plate and composite back plate for semiconductor chip LGA package and cooling assembly retention |
Phil Geng, Ralph V. Miele, Jeffory L. Smalley, Eric W. Buddrius, Sean T. Sivapalan +2 more |
2025-04-15 |
|
| 12262478 |
Selectively applied protective layer on exposed materials of electronic circuit board and electronic components disposed thereon for immersion bath cooled systems |
Jin Yang |
2025-03-25 |
|
| 12248344 |
Technologies for liquid cooling interfaces |
Kristin L. Weldon, David Rodriguez, Jin Yang, Jimmy Chuang, Mohanraj Prabhugoud +1 more |
2025-03-11 |
|
| 12131977 |
Electronic systems with inverted circuit board with heat sink to chassis attachment |
Barrett M. Faneuf, Phil Geng, Kenan Arik, Casey Winkel, Sandeep Ahuja +9 more |
2024-10-29 |
$18,861,000 |
| 12133357 |
Cold plate architecture for liquid cooling of devices |
Jin Yang, Mohanraj Prabhugoud, Olaotan ELENITOBA-JOHNSON, Craig Jahne, Phil Geng |
2024-10-29 |
$18,861,000 |
| 12063759 |
Conformable cold plate for fluid cooling applications |
Berhanu Wondimu, Xudong Tang |
2024-08-13 |
$26,861,000 |
| 12057370 |
Vacuum modulated two phase cooling loop efficiency and parallelism enhancement |
Paul Diglio, Pooya Tadayon |
2024-08-06 |
$17,070,000 |
| 11976671 |
Vacuum modulated two phase cooling loop performance enhancement |
Paul Diglio, Pooya Tadayon |
2024-05-07 |
$26,756,000 |
| 11842943 |
Electronic systems with inverted circuit board with heat sink to chassis attachment |
Barrett M. Faneuf, Phil Geng, Kenan Arik, Casey Winkel, Sandeep Ahuja +9 more |
2023-12-12 |
$45,136,000 |
| 11449111 |
Scalable, high load, low stiffness, and small footprint loading mechanism |
Eric W. Buddrius, Ralph V. Miele, Mohanraj Prabhugoud, Jeffory L. Smalley |
2022-09-20 |
$15,654,000 |
| 11262384 |
Fine pitch probe card methods and systems |
Pooya Tadayon |
2022-03-01 |
$16,941,000 |
| 10677845 |
Converged test platforms and processes for class and system testing of integrated circuits |
Abram M. Detofsky, Evan M. Fledell, Mustapha Amadu Abdulai, John M. Peterson, Dinia P. Kitendaugh +2 more |
2020-06-09 |
$37,008,000 |
| 10595439 |
Movable heatsink utilizing flexible heat pipes |
Evan A. Chenelly, Mohanraj Prabhugoud |
2020-03-17 |
$21,927,000 |
| 9977054 |
Etching for probe wire tips for microelectronic device test |
Todd P. Albertson, David Craig, Joseph D. Stanford |
2018-05-22 |
$37,728,000 |
| 9535095 |
Anti-rotation for wire probes in a probe head of a die tester |
Todd P. Albertson, Keith J. Martin |
2017-01-03 |
$8,191,000 |
| 9366482 |
Adjustable heat pipe thermal unit |
Jin Yang |
2016-06-14 |
$9,885,000 |
| 9354273 |
Composite wire probe test assembly |
Kip P. Stevenson, Todd P. Albertson, Kamil Salloum |
2016-05-31 |
$9,993,000 |
