Mengqi Liu — 5 Patents at Intel

Mengqi Liu has been granted 5 US patents while listed as an inventor at Intel. The first was granted in 2023 and the most recent in May 2025. Mengqi Liu ranks #907,971 of 4,157,543 US inventors in our database (top 21.8%). Patent records list Mengqi Liu in Hillsboro, OR, US.

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Showing 1–5 of 5 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
12315780	Technologies for processor loading mechanisms	Ralph V. Miele, Phil Geng, David Shia, Sandeep Ahuja, Eric W. Buddrius +1 more	2025-05-27
12309966	Thermally conductive chamber with stiffening structure for thermal cooling assembly of semiconductor chip package under high loading force	Jin Yang, Jimmy Chuang, Phil Geng, Ralph V. Miele, Sandeep Ahuja +1 more	2025-05-20
12279395	Patterned bolster plate and composite back plate for semiconductor chip LGA package and cooling assembly retention	Phil Geng, Ralph V. Miele, David Shia, Jeffory L. Smalley, Eric W. Buddrius +2 more	2025-04-15
12098982	Biochemical sludge and physicochemical sludge separate sampling device for identifying attributes of sludge	Xiaofei Yan, Jinglong Liu, Houhu Zhang, Dong Xu, Congcong M. Sun +3 more	2024-09-24
11678444	Loading mechanism with integrated heatsink	Olaotan ELENITOBA-JOHNSON, Mark Hemmeyer	2023-06-13	$22,204,000

Mengqi Liu — 5 Patents

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