PG

Phil Geng

IN Intel: 17 patents #2,418 of 30,777Top 8%
Overall (All Time): #264,028 of 4,157,543Top 7%
17
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
12334674 DIMM retention assembly for compression mount technology and land grid array connector loading Xiang Li, George Vergis 2025-06-17
12315780 Technologies for processor loading mechanisms Ralph V. Miele, Mengqi Liu, David Shia, Sandeep Ahuja, Eric W. Buddrius +1 more 2025-05-27
12309933 Magnetically secured semiconductor chip package loading assembly Timothy Glen Hanna, Xiaoning Ye, Sandeep Ahuja, Jacob McMillian, Ralph V. Miele +2 more 2025-05-20
12309966 Thermally conductive chamber with stiffening structure for thermal cooling assembly of semiconductor chip package under high loading force Jin Yang, Jimmy Chuang, Mengqi Liu, Ralph V. Miele, Sandeep Ahuja +1 more 2025-05-20
12279395 Patterned bolster plate and composite back plate for semiconductor chip LGA package and cooling assembly retention Ralph V. Miele, David Shia, Jeffory L. Smalley, Eric W. Buddrius, Sean T. Sivapalan +2 more 2025-04-15
12131977 Electronic systems with inverted circuit board with heat sink to chassis attachment Barrett M. Faneuf, Kenan Arik, David Shia, Casey Winkel, Sandeep Ahuja +9 more 2024-10-29
12133357 Cold plate architecture for liquid cooling of devices Jin Yang, David Shia, Mohanraj Prabhugoud, Olaotan ELENITOBA-JOHNSON, Craig Jahne 2024-10-29
11984685 Retention latch with spring mechanism Xiang Li, George Vergis, Mani N. Prakash 2024-05-14
11842943 Electronic systems with inverted circuit board with heat sink to chassis attachment Barrett M. Faneuf, Kenan Arik, David Shia, Casey Winkel, Sandeep Ahuja +9 more 2023-12-12
11587597 Connector retention mechanism for improved structural reliability Xiang Li, George Vergis, Mani N. Prakash 2023-02-21
11495518 Multi-surface heat sink suitable for multi-chip packages Shrenik Kothari, Sandeep Ahuja, Susan F. Smith, Jeffory L. Smalley, Francisco Gabriel Lozano Sanchez +5 more 2022-11-08
10950958 Memory module connector, memory module, and pivotable latch Xiang Li, Mani N. Prakash, George Vergis 2021-03-16
10888010 Retention of dual in-line memory modules George Vergis, Xiang Li 2021-01-05
10790603 Connector with relaxation mechanism for latch Xiang Li, George Vergis, Mani N. Prakash 2020-09-29
7208348 Methods of fabricating a via-in-pad with off-center geometry Stephen C. Joy 2007-04-24
6833615 Via-in-pad with off-center geometry Stephen C. Joy 2004-12-21
6622905 Design and assembly methodology for reducing bridging in bonding electronic components to pads connected to vias Daniel Edward Shier, Scott Dixon 2003-09-23