Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12334674 | DIMM retention assembly for compression mount technology and land grid array connector loading | Xiang Li, George Vergis | 2025-06-17 |
| 12315780 | Technologies for processor loading mechanisms | Ralph V. Miele, Mengqi Liu, David Shia, Sandeep Ahuja, Eric W. Buddrius +1 more | 2025-05-27 |
| 12309933 | Magnetically secured semiconductor chip package loading assembly | Timothy Glen Hanna, Xiaoning Ye, Sandeep Ahuja, Jacob McMillian, Ralph V. Miele +2 more | 2025-05-20 |
| 12309966 | Thermally conductive chamber with stiffening structure for thermal cooling assembly of semiconductor chip package under high loading force | Jin Yang, Jimmy Chuang, Mengqi Liu, Ralph V. Miele, Sandeep Ahuja +1 more | 2025-05-20 |
| 12279395 | Patterned bolster plate and composite back plate for semiconductor chip LGA package and cooling assembly retention | Ralph V. Miele, David Shia, Jeffory L. Smalley, Eric W. Buddrius, Sean T. Sivapalan +2 more | 2025-04-15 |
| 12131977 | Electronic systems with inverted circuit board with heat sink to chassis attachment | Barrett M. Faneuf, Kenan Arik, David Shia, Casey Winkel, Sandeep Ahuja +9 more | 2024-10-29 |
| 12133357 | Cold plate architecture for liquid cooling of devices | Jin Yang, David Shia, Mohanraj Prabhugoud, Olaotan ELENITOBA-JOHNSON, Craig Jahne | 2024-10-29 |
| 11984685 | Retention latch with spring mechanism | Xiang Li, George Vergis, Mani N. Prakash | 2024-05-14 |
| 11842943 | Electronic systems with inverted circuit board with heat sink to chassis attachment | Barrett M. Faneuf, Kenan Arik, David Shia, Casey Winkel, Sandeep Ahuja +9 more | 2023-12-12 |
| 11587597 | Connector retention mechanism for improved structural reliability | Xiang Li, George Vergis, Mani N. Prakash | 2023-02-21 |
| 11495518 | Multi-surface heat sink suitable for multi-chip packages | Shrenik Kothari, Sandeep Ahuja, Susan F. Smith, Jeffory L. Smalley, Francisco Gabriel Lozano Sanchez +5 more | 2022-11-08 |
| 10950958 | Memory module connector, memory module, and pivotable latch | Xiang Li, Mani N. Prakash, George Vergis | 2021-03-16 |
| 10888010 | Retention of dual in-line memory modules | George Vergis, Xiang Li | 2021-01-05 |
| 10790603 | Connector with relaxation mechanism for latch | Xiang Li, George Vergis, Mani N. Prakash | 2020-09-29 |
| 7208348 | Methods of fabricating a via-in-pad with off-center geometry | Stephen C. Joy | 2007-04-24 |
| 6833615 | Via-in-pad with off-center geometry | Stephen C. Joy | 2004-12-21 |
| 6622905 | Design and assembly methodology for reducing bridging in bonding electronic components to pads connected to vias | Daniel Edward Shier, Scott Dixon | 2003-09-23 |