| 12494441 |
BGA stiffener attachment with low Eolife adhesive strength at high solder joint stress area generated from enabling load |
Patrick Nardi, Ravindranath V. Mahajan, Dingying Xu, Praveen Raghavan, John Harper +2 more |
2025-12-09 |
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| 12476167 |
Semiconductor chip package thermo-mechanical cooling assembly |
Olaotan ELENITOBA-JOHNSON, Eric C. Erike, Jeffory L. Smalley, Ulises Encarnacion, Ralph V. Miele +2 more |
2025-11-18 |
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| 12453054 |
Cooling assembly with strap element to diminish lateral movement of cooling mass during installation of the cooling mass |
Ralph V. Miele, David Shia, Sandeep Ahuja, Jeffory L. Smalley |
2025-10-21 |
|
| 12334674 |
DIMM retention assembly for compression mount technology and land grid array connector loading |
Xiang Li, George Vergis |
2025-06-17 |
|
| 12315780 |
Technologies for processor loading mechanisms |
Ralph V. Miele, Mengqi Liu, David Shia, Sandeep Ahuja, Eric W. Buddrius +1 more |
2025-05-27 |
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| 12309966 |
Thermally conductive chamber with stiffening structure for thermal cooling assembly of semiconductor chip package under high loading force |
Jin Yang, Jimmy Chuang, Mengqi Liu, Ralph V. Miele, Sandeep Ahuja +1 more |
2025-05-20 |
|
| 12309933 |
Magnetically secured semiconductor chip package loading assembly |
Timothy Glen Hanna, Xiaoning Ye, Sandeep Ahuja, Jacob McMillian, Ralph V. Miele +2 more |
2025-05-20 |
|
| 12279395 |
Patterned bolster plate and composite back plate for semiconductor chip LGA package and cooling assembly retention |
Ralph V. Miele, David Shia, Jeffory L. Smalley, Eric W. Buddrius, Sean T. Sivapalan +2 more |
2025-04-15 |
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| 12133357 |
Cold plate architecture for liquid cooling of devices |
Jin Yang, David Shia, Mohanraj Prabhugoud, Olaotan ELENITOBA-JOHNSON, Craig Jahne |
2024-10-29 |
$18,861,000 |
| 12131977 |
Electronic systems with inverted circuit board with heat sink to chassis attachment |
Barrett M. Faneuf, Kenan Arik, David Shia, Casey Winkel, Sandeep Ahuja +9 more |
2024-10-29 |
$18,861,000 |
| 11984685 |
Retention latch with spring mechanism |
Xiang Li, George Vergis, Mani N. Prakash |
2024-05-14 |
$33,809,000 |
| 11842943 |
Electronic systems with inverted circuit board with heat sink to chassis attachment |
Barrett M. Faneuf, Kenan Arik, David Shia, Casey Winkel, Sandeep Ahuja +9 more |
2023-12-12 |
$45,136,000 |
| 11587597 |
Connector retention mechanism for improved structural reliability |
Xiang Li, George Vergis, Mani N. Prakash |
2023-02-21 |
$13,703,000 |
| 11495518 |
Multi-surface heat sink suitable for multi-chip packages |
Shrenik Kothari, Sandeep Ahuja, Susan F. Smith, Jeffory L. Smalley, Francisco Gabriel Lozano Sanchez +5 more |
2022-11-08 |
$15,080,000 |
| 10950958 |
Memory module connector, memory module, and pivotable latch |
Xiang Li, Mani N. Prakash, George Vergis |
2021-03-16 |
$38,556,000 |
| 10888010 |
Retention of dual in-line memory modules |
George Vergis, Xiang Li |
2021-01-05 |
$27,050,000 |
| 10790603 |
Connector with relaxation mechanism for latch |
Xiang Li, George Vergis, Mani N. Prakash |
2020-09-29 |
$31,444,000 |
| 7208348 |
Methods of fabricating a via-in-pad with off-center geometry |
Stephen C. Joy |
2007-04-24 |
$13,574,000 |
| 6833615 |
Via-in-pad with off-center geometry |
Stephen C. Joy |
2004-12-21 |
$44,553,000 |
| 6622905 |
Design and assembly methodology for reducing bridging in bonding electronic components to pads connected to vias |
Daniel Edward Shier, Scott Dixon |
2003-09-23 |
$27,638,000 |
