| 12453054 |
Cooling assembly with strap element to diminish lateral movement of cooling mass during installation of the cooling mass |
Phil Geng, Ralph V. Miele, David Shia, Jeffory L. Smalley |
2025-10-21 |
|
| 12315780 |
Technologies for processor loading mechanisms |
Ralph V. Miele, Phil Geng, Mengqi Liu, David Shia, Eric W. Buddrius +1 more |
2025-05-27 |
|
| 12309933 |
Magnetically secured semiconductor chip package loading assembly |
Phil Geng, Timothy Glen Hanna, Xiaoning Ye, Jacob McMillian, Ralph V. Miele +2 more |
2025-05-20 |
|
| 12309966 |
Thermally conductive chamber with stiffening structure for thermal cooling assembly of semiconductor chip package under high loading force |
Jin Yang, Jimmy Chuang, Mengqi Liu, Phil Geng, Ralph V. Miele +1 more |
2025-05-20 |
|
| 12131977 |
Electronic systems with inverted circuit board with heat sink to chassis attachment |
Barrett M. Faneuf, Phil Geng, Kenan Arik, David Shia, Casey Winkel +9 more |
2024-10-29 |
$18,861,000 |
| 11842943 |
Electronic systems with inverted circuit board with heat sink to chassis attachment |
Barrett M. Faneuf, Phil Geng, Kenan Arik, David Shia, Casey Winkel +9 more |
2023-12-12 |
$45,136,000 |
| 11543868 |
Apparatus and method to provide a thermal parameter report for a multi-chip package |
Tessil Thomas, Robin A. Steinbrecher, Michael Berktold, Timothy Y. Kam, Howard Chin +2 more |
2023-01-03 |
$15,575,000 |
| 11495518 |
Multi-surface heat sink suitable for multi-chip packages |
Shrenik Kothari, Susan F. Smith, Jeffory L. Smalley, Francisco Gabriel Lozano Sanchez, Maria de la Luz Belmont Velazquez +5 more |
2022-11-08 |
$15,080,000 |
| 11137807 |
System, apparatus and method for controllable processor configuration based on a temperature specification |
Nikhil Gupta, Vasudevan Srinivasan |
2021-10-05 |
$23,463,000 |
| 11068623 |
Automated building design guidance software that optimizes cost, energy, daylight, glare, and thermal comfort |
Patrick Mark Chopson, Daniel Jay Chopson |
2021-07-20 |
|
| 10908660 |
Determining thermal margins in a multi-die processor |
Jeremy Ridge, Michael Berktold |
2021-02-02 |
$28,243,000 |
| 10877530 |
Apparatus and method to provide a thermal parameter report for a multi-chip package |
Tessil Thomas, Robin A. Steinbrecher, Michael Berktold, Timothy Y. Kam, Howard Chin +2 more |
2020-12-29 |
$24,597,000 |
| 10667438 |
Maintenance prediction of electronic devices using periodic thermal evaluation |
Robin A. Steinbrecher, Nishi Ahuja |
2020-05-26 |
$31,191,000 |
| 10275001 |
Thermal throttling of electronic devices |
Timothy Y. Kam, Rajat Agarwal, Avinash Sodani, Jinho Suh, Meenakshisundaram R. Chinthamani |
2019-04-30 |
$31,713,000 |
| 10248173 |
Determining thermal margins in a multi-die processor |
Jeremy Ridge, Michael Berktold |
2019-04-02 |
$26,887,000 |
| 9971890 |
Securing thermal management parameters in firmware from cyber attack |
Robin A. Steinbrecher, David R. Richardson |
2018-05-15 |
$21,346,000 |
| 9646910 |
Integrated heat spreader that maximizes heat transfer from a multi-chip package |
Eric W. Buddrius, Roger D. Flynn, Rajat Agarwal |
2017-05-09 |
$10,144,000 |
| 9494996 |
Processor having frequency of operation information for guaranteed operation under high temperature events |
Ankush Varma, Robin A. Steinbrecher, Susan F. Smith, Vivek Garg, Tessil Thomas +3 more |
2016-11-15 |
$10,003,000 |
| 9355249 |
Securing thermal management parameters in firmware from cyber attack |
Robin A. Steinbrecher, David R. Richardson |
2016-05-31 |
$9,993,000 |
| 9257364 |
Integrated heat spreader that maximizes heat transfer from a multi-chip package |
Eric W. Buddrius, Roger D. Flynn, Rajat Agarwal |
2016-02-09 |
$15,927,000 |
| 9142482 |
Transient thermal management systems for semiconductor devices |
Ioan Sauciuc, Susan F. Smith |
2015-09-22 |
$9,820,000 |
| 9116050 |
Sensor-based thermal specification enabling a real-time metric for compliance |
Robin A. Steinbrecher, Susan F. Smith, David J. Ayers |
2015-08-25 |
$14,120,000 |
| 8538598 |
Power and thermal optimization of processor and cooling |
Robin A. Steinbrecher, Casey Winkel |
2013-09-17 |
$13,720,000 |
| 8260474 |
Sensor-based thermal specification enabling a real-time metric for compliance |
Robin A. Steinbrecher, Susan F. Smith, David J. Ayers |
2012-09-04 |
$13,616,000 |
| 7751189 |
Cooling arrangement to cool components on circuit board |
Ioan Sauciuc |
2010-07-06 |
$9,424,000 |
