Issued Patents All Time
Showing 25 most recent of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12315780 | Technologies for processor loading mechanisms | Ralph V. Miele, Phil Geng, Mengqi Liu, David Shia, Eric W. Buddrius +1 more | 2025-05-27 |
| 12309933 | Magnetically secured semiconductor chip package loading assembly | Phil Geng, Timothy Glen Hanna, Xiaoning Ye, Jacob McMillian, Ralph V. Miele +2 more | 2025-05-20 |
| 12309966 | Thermally conductive chamber with stiffening structure for thermal cooling assembly of semiconductor chip package under high loading force | Jin Yang, Jimmy Chuang, Mengqi Liu, Phil Geng, Ralph V. Miele +1 more | 2025-05-20 |
| 12131977 | Electronic systems with inverted circuit board with heat sink to chassis attachment | Barrett M. Faneuf, Phil Geng, Kenan Arik, David Shia, Casey Winkel +9 more | 2024-10-29 |
| 11842943 | Electronic systems with inverted circuit board with heat sink to chassis attachment | Barrett M. Faneuf, Phil Geng, Kenan Arik, David Shia, Casey Winkel +9 more | 2023-12-12 |
| 11543868 | Apparatus and method to provide a thermal parameter report for a multi-chip package | Tessil Thomas, Robin A. Steinbrecher, Michael Berktold, Timothy Y. Kam, Howard Chin +2 more | 2023-01-03 |
| 11495518 | Multi-surface heat sink suitable for multi-chip packages | Shrenik Kothari, Susan F. Smith, Jeffory L. Smalley, Francisco Gabriel Lozano Sanchez, Maria de la Luz Belmont Velazquez +5 more | 2022-11-08 |
| 11137807 | System, apparatus and method for controllable processor configuration based on a temperature specification | Nikhil Gupta, Vasudevan Srinivasan | 2021-10-05 |
| 11068623 | Automated building design guidance software that optimizes cost, energy, daylight, glare, and thermal comfort | Patrick Mark Chopson, Daniel Jay Chopson | 2021-07-20 |
| 10908660 | Determining thermal margins in a multi-die processor | Jeremy Ridge, Michael Berktold | 2021-02-02 |
| 10877530 | Apparatus and method to provide a thermal parameter report for a multi-chip package | Tessil Thomas, Robin A. Steinbrecher, Michael Berktold, Timothy Y. Kam, Howard Chin +2 more | 2020-12-29 |
| 10667438 | Maintenance prediction of electronic devices using periodic thermal evaluation | Robin A. Steinbrecher, Nishi Ahuja | 2020-05-26 |
| 10275001 | Thermal throttling of electronic devices | Timothy Y. Kam, Rajat Agarwal, Avinash Sodani, Jinho Suh, Meenakshisundaram R. Chinthamani | 2019-04-30 |
| 10248173 | Determining thermal margins in a multi-die processor | Jeremy Ridge, Michael Berktold | 2019-04-02 |
| 9971890 | Securing thermal management parameters in firmware from cyber attack | Robin A. Steinbrecher, David R. Richardson | 2018-05-15 |
| 9646910 | Integrated heat spreader that maximizes heat transfer from a multi-chip package | Eric W. Buddrius, Roger D. Flynn, Rajat Agarwal | 2017-05-09 |
| 9494996 | Processor having frequency of operation information for guaranteed operation under high temperature events | Ankush Varma, Robin A. Steinbrecher, Susan F. Smith, Vivek Garg, Tessil Thomas +3 more | 2016-11-15 |
| 9355249 | Securing thermal management parameters in firmware from cyber attack | Robin A. Steinbrecher, David R. Richardson | 2016-05-31 |
| 9257364 | Integrated heat spreader that maximizes heat transfer from a multi-chip package | Eric W. Buddrius, Roger D. Flynn, Rajat Agarwal | 2016-02-09 |
| 9142482 | Transient thermal management systems for semiconductor devices | Ioan Sauciuc, Susan F. Smith | 2015-09-22 |
| 9116050 | Sensor-based thermal specification enabling a real-time metric for compliance | Robin A. Steinbrecher, Susan F. Smith, David J. Ayers | 2015-08-25 |
| 8538598 | Power and thermal optimization of processor and cooling | Robin A. Steinbrecher, Casey Winkel | 2013-09-17 |
| 8260474 | Sensor-based thermal specification enabling a real-time metric for compliance | Robin A. Steinbrecher, Susan F. Smith, David J. Ayers | 2012-09-04 |
| 7751189 | Cooling arrangement to cool components on circuit board | Ioan Sauciuc | 2010-07-06 |
| 7742299 | Piezo fans for cooling an electronic device | Ioan Sauciuc, Ashish Gupta | 2010-06-22 |