Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11543868 | Apparatus and method to provide a thermal parameter report for a multi-chip package | Tessil Thomas, Robin A. Steinbrecher, Sandeep Ahuja, Timothy Y. Kam, Howard Chin +2 more | 2023-01-03 |
| 10939592 | Liquid cooling system with sub atmospheric pressure coolant | Javier AVALOS GARCIA, Luz Karine SANDOVAL GRANADOS, Adriana LOPEZ INIGUEZ | 2021-03-02 |
| 10908660 | Determining thermal margins in a multi-die processor | Sandeep Ahuja, Jeremy Ridge | 2021-02-02 |
| 10877530 | Apparatus and method to provide a thermal parameter report for a multi-chip package | Tessil Thomas, Robin A. Steinbrecher, Sandeep Ahuja, Timothy Y. Kam, Howard Chin +2 more | 2020-12-29 |
| 10248173 | Determining thermal margins in a multi-die processor | Sandeep Ahuja, Jeremy Ridge | 2019-04-02 |