Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12293956 | Boiling enhancement structures for immersion cooled electronic systems | Jin Yang, Jimmy Chuang, Xicai Jing, Yuan-Liang Li, Yuyang XIA +9 more | 2025-05-06 |
| 10939592 | Liquid cooling system with sub atmospheric pressure coolant | Michael Berktold, Luz Karine SANDOVAL GRANADOS, Adriana LOPEZ INIGUEZ | 2021-03-02 |