Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Integrated heat spreader that maximizes heat transfer from a multi-chip package

Integrated heat spreader that maximizes heat transfer from a multi-chip package

US Patent 9257364 · Granted Feb 9, 2016

Estimated economic value: $15,927,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Cooling assembly with strap element to diminish lateral movement of cooling mass2025
Liquid cooling system leak detection improvements2025
System and methods for real time raman spectroscopy for cancer detection2025
Dynamic multilevel memory system2025
Selective fill for logical control over hardware multilevel memory2025
Distribution of error checking and correction (ECC) bits to allocate ECC bits fo2025
Adaptive internal error scrubbing and error handling2025
Nonlinearity cancellation circuit for active filters2025
Interconnect architecture with silicon interposer and EMIB2025
Universal retrofit of controlled locking access in a locker solution method and 2025
Technologies for processor loading mechanisms2025
Technologies for processor loading mechanisms2025