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USPTO Patent Rankings Data through Dec 31, 2025
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Eric W. Buddrius — 14 Patents

Intel: 14 patents #2,935 of 30,777Top 10%
Hillsboro, OR: #319 of 2,365 inventorsTop 15%
Oregon: #3,136 of 28,073 inventorsTop 15%
Overall (All Time): #332,869 of 4,157,543Top 9%
14 Patents All Time
Eric W. Buddrius has been granted 14 US patents while listed as an inventor at Intel. The first was granted in 2016 and the most recent in October 2025. Eric W. Buddrius ranks #332,869 of 4,157,543 US inventors in our database (top 8.0%). Patent records list Eric W. Buddrius in Hillsboro, OR, US.

Issued Patents All Time

Showing 1–14 of 14 patents

Patent #TitleCo-InventorsDateApprox Value ⓘ
12442712 Liquid cooling system leak detection improvements Prabhakar Subrahmanyam, Yingbo Xia, Ying-Feng PANG, Victor Polyanko, Mark Lawrence Bianco +27 more 2025-10-14
12315780 Technologies for processor loading mechanisms Ralph V. Miele, Phil Geng, Mengqi Liu, David Shia, Sandeep Ahuja +1 more 2025-05-27
12279395 Patterned bolster plate and composite back plate for semiconductor chip LGA package and cooling assembly retention Phil Geng, Ralph V. Miele, David Shia, Jeffory L. Smalley, Sean T. Sivapalan +2 more 2025-04-15
12176643 Compression mounted technology (CMT) socket system retention mechanisms designs for shipping reliability risk mitigation Thomas A. Boyd, Feifei Cheng, Mohanraj Prabhugoud 2024-12-24 $17,261,000
11818832 Socket load regulation utilizing CPU carriers with shim components Feroz Mohammad, Ralph V. Miele, Thomas A. Boyd, Steven A. Klein, Gregorio R. Murtagian +2 more 2023-11-14 $31,444,000
11557529 Mechanism combining fastener captivation and assembly tilt control for microprocessor thermal solutions Thomas A. Boyd, Ming-Chen Chang, Evan A. Chenelly, Divya Swamy Bandaru, Craig Jahne +5 more 2023-01-17 $13,997,000
11449111 Scalable, high load, low stiffness, and small footprint loading mechanism Ralph V. Miele, Mohanraj Prabhugoud, David Shia, Jeffory L. Smalley 2022-09-20 $15,654,000
11387163 Scalable debris-free socket loading mechanism Andrew Larson, Bijoyraj Sahu, Craig Jahne, Ralph V. Miele 2022-07-12 $13,106,000
11291115 Server microprocessor carrier with guiding alignment anti-tilt and automatic thermal interface material separation features for use in land grid array sockets Shelby Ferguson, Bijoyraj Sahu, Russell S. Aoki, Thomas A. Boyd, Kevin Ceurter +5 more 2022-03-29 $28,068,000
10680367 Cable retention assemblies including torsional elements Feifei Cheng, Kuang Liu, Michael Garcia, Kevin Ceurter, Anthony P. Valpiani +1 more 2020-06-09 $37,008,000
10455685 Electronic device, socket, and spacer to alter socket profile Steven A. Klein, Kuang Liu, Thomas A. Boyd, Luis Gil Rangel, Muffadal Mukadem +5 more 2019-10-22 $16,310,000
9825387 Linear edge connector with a cable retention mechanism having a body with a groove with an indentation to receive a bolster plate protrusion Feifei Cheng, Kuang Liu, Michael Garcia, Kevin Ceurter, Jonathon Robert Carstens 2017-11-21 $11,290,000
9646910 Integrated heat spreader that maximizes heat transfer from a multi-chip package Sandeep Ahuja, Roger D. Flynn, Rajat Agarwal 2017-05-09 $10,144,000
9257364 Integrated heat spreader that maximizes heat transfer from a multi-chip package Sandeep Ahuja, Roger D. Flynn, Rajat Agarwal 2016-02-09 $15,927,000