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Technologies for processor loading mechanisms |
Ralph V. Miele, Phil Geng, Mengqi Liu, David Shia, Sandeep Ahuja +1 more |
2025-05-27 |
| 12279395 |
Patterned bolster plate and composite back plate for semiconductor chip LGA package and cooling assembly retention |
Phil Geng, Ralph V. Miele, David Shia, Jeffory L. Smalley, Sean T. Sivapalan +2 more |
2025-04-15 |
| 12176643 |
Compression mounted technology (CMT) socket system retention mechanisms designs for shipping reliability risk mitigation |
Thomas A. Boyd, Feifei Cheng, Mohanraj Prabhugoud |
2024-12-24 |
| 11818832 |
Socket load regulation utilizing CPU carriers with shim components |
Feroz Mohammad, Ralph V. Miele, Thomas A. Boyd, Steven A. Klein, Gregorio R. Murtagian +2 more |
2023-11-14 |
| 11557529 |
Mechanism combining fastener captivation and assembly tilt control for microprocessor thermal solutions |
Thomas A. Boyd, Ming-Chen Chang, Evan A. Chenelly, Divya Swamy Bandaru, Craig Jahne +5 more |
2023-01-17 |
| 11449111 |
Scalable, high load, low stiffness, and small footprint loading mechanism |
Ralph V. Miele, Mohanraj Prabhugoud, David Shia, Jeffory L. Smalley |
2022-09-20 |
| 11387163 |
Scalable debris-free socket loading mechanism |
Andrew Larson, Bijoyraj Sahu, Craig Jahne, Ralph V. Miele |
2022-07-12 |
| 11291115 |
Server microprocessor carrier with guiding alignment anti-tilt and automatic thermal interface material separation features for use in land grid array sockets |
Shelby Ferguson, Bijoyraj Sahu, Russell S. Aoki, Thomas A. Boyd, Kevin Ceurter +5 more |
2022-03-29 |
| 10680367 |
Cable retention assemblies including torsional elements |
Feifei Cheng, Kuang Liu, Michael Garcia, Kevin Ceurter, Anthony P. Valpiani +1 more |
2020-06-09 |
| 10455685 |
Electronic device, socket, and spacer to alter socket profile |
Steven A. Klein, Kuang Liu, Thomas A. Boyd, Luis Gil Rangel, Muffadal Mukadem +5 more |
2019-10-22 |
| 9825387 |
Linear edge connector with a cable retention mechanism having a body with a groove with an indentation to receive a bolster plate protrusion |
Feifei Cheng, Kuang Liu, Michael Garcia, Kevin Ceurter, Jonathon Robert Carstens |
2017-11-21 |
| 9646910 |
Integrated heat spreader that maximizes heat transfer from a multi-chip package |
Sandeep Ahuja, Roger D. Flynn, Rajat Agarwal |
2017-05-09 |
| 9257364 |
Integrated heat spreader that maximizes heat transfer from a multi-chip package |
Sandeep Ahuja, Roger D. Flynn, Rajat Agarwal |
2016-02-09 |