| 12394700 |
Semiconductor package |
Dongkyu Kim, Seokhyun Lee, Kyoung Lim Suk, Jaegwon Jang |
2025-08-19 |
| 12300589 |
Semiconductor package |
Jung-Ho Park, Seokhyun Lee, Yaejung YOON |
2025-05-13 |
| 12230556 |
Semiconductor package and method of fabricating the same |
Jongyoun Kim, Minjun Bae, Hyeonseok LEE |
2025-02-18 |
| 11948872 |
Semiconductor package and method of fabricating the same |
Jongyoun Kim, Minjun Bae, Hyeonseok LEE |
2024-04-02 |
| 11929316 |
Semiconductor package and method of fabricating the same |
Jongyoun Kim, Eungkyu Kim |
2024-03-12 |
| 11837551 |
Semiconductor package |
Jongyoun Kim, Seokhyun Lee |
2023-12-05 |
| 11804427 |
Semiconductor package |
Dongkyu Kim, Seokhyun Lee, Kyoung Lim Suk, Jaegwon Jang |
2023-10-31 |
| 11791295 |
Semiconductor package with thick under-bump terminal |
Dongkyu Kim, Jung-Ho Park, Yeonho Jang |
2023-10-17 |
| 11705341 |
Method of fabricating a semiconductor package having redistribution patterns including seed patterns and seed layers |
Seokhyun Lee |
2023-07-18 |
| 11646260 |
Semiconductor package and method of fabricating the same |
Jongyoun Kim, Eungkyu Kim |
2023-05-09 |
| 11508649 |
Semiconductor package including substrate with outer insulating layer |
Eungkyu Kim, Jongyoun Kim |
2022-11-22 |
| 11348864 |
Redistribution substrate having redistribution pattern including via seed patterns covering bottom surface and sidewall surface of wiring conductive patterns and semiconductor package including the same |
Seokhyun Lee |
2022-05-31 |
| 11056461 |
Method of manufacturing fan-out wafer level package |
Yeonho Jang, Dongkyu Kim, Jungho Park, Seokhyun Lee |
2021-07-06 |
