Issued Patents All Time
Showing 25 most recent of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12394700 | Semiconductor package | Dongkyu Kim, Seokhyun Lee, Kyoung Lim Suk, Gwangjae Jeon | 2025-08-19 |
| 12300625 | Semiconductor package including outer conductive plate | Minjung Kim, Dongkyu Kim, Jongyoun Kim, Seokhyun Lee | 2025-05-13 |
| 12261106 | Semiconductor package | Hyeonjeong Hwang, Kyoung Lim Suk, Seokhyun Lee | 2025-03-25 |
| 12170251 | Semiconductor package | Kyoung Lim Suk, Seokhyun Lee | 2024-12-17 |
| 12087744 | Semiconductor package device | Dongkyu Kim, Seokhyun Lee, Yeonho Jang | 2024-09-10 |
| 12014975 | Semiconductor package | Kyoung Lim Suk, Minjun Bae | 2024-06-18 |
| 12015018 | Semiconductor package with multiple redistribution substrates | Hyeonjeong Hwang, Kyoung Lim Suk, Seokhyun Lee | 2024-06-18 |
| 11955499 | Image sensor package including glass substrate and a plurality of redistribution layers disposed below the glass substrate and spaced apart from each other by a predetermined distance | Minjung Kim, Dongkyu Kim, Kyounglim Suk, Hyeonjeong Hwang | 2024-04-09 |
| 11901276 | Semiconductor package and method of manufacturing the same | Yeonho Jang, Jongyoun Kim, Jungho Park | 2024-02-13 |
| 11887931 | Semiconductor package with stepped redistribution structure exposing mold layer | Inhyung SONG, Kyoung Lim Suk, Wonkyoung Choi | 2024-01-30 |
| 11869835 | Semiconductor package | Seokhyun Lee, Jongyoun Kim, Yeonho Jang | 2024-01-09 |
| 11869775 | Semiconductor packages | Seokhyun Lee, Kyoung Lim Suk, Ae-Nee Jang | 2024-01-09 |
| 11810915 | Semiconductor package with redistribution substrate having embedded passive device | Kyoung Lim Suk, Seokhyun Lee | 2023-11-07 |
| 11804427 | Semiconductor package | Dongkyu Kim, Seokhyun Lee, Kyoung Lim Suk, Gwangjae Jeon | 2023-10-31 |
| 11637081 | Semiconductor package and method of manufacturing the same | Jongyoun Kim, Jungho Park, Seokhyun Lee, Yeonho Jang | 2023-04-25 |
| 11616051 | Semiconductor package device | Dongkyu Kim, Seokhyun Lee, Yeonho Jang | 2023-03-28 |
| 11610785 | Semiconductor packages | Seokhyun Lee, Kyoung Lim Suk, Ae-Nee Jang | 2023-03-21 |
| 11569157 | Semiconductor package and method of manufacturing the same | Yeonho Jang, Jongyoun Kim, Jungho Park | 2023-01-31 |
| 11538798 | Semiconductor package with multiple redistribution substrates | Hyeonjeong Hwang, Kyoung Lim Suk, Seokhyun Lee | 2022-12-27 |
| 11456241 | Semiconductor package | Seokhyun Lee, Jongyoun Kim, Yeonho Jang | 2022-09-27 |
| 11145611 | Semiconductor package and method of manufacturing the same | Jongyoun Kim, Jungho Park, Seokhyun Lee, Yeonho Jang | 2021-10-12 |
| 11094636 | Semiconductor package and method of manufacturing the semiconductor package | Inwon O, Jongyoun Kim, Seokhyun Lee, Yeonho Jang | 2021-08-17 |
| 10879292 | Semiconductor package and method of manufacturing the same | Seokhyun Lee, Kyoung Lim Suk | 2020-12-29 |
| 9818703 | Printed circuit board | Youngjae Kim, Baikwoo Lee | 2017-11-14 |
| 9373574 | Semiconductor packages and methods of forming the same | Ae-Nee Jang, Young Lyong Kim | 2016-06-21 |