Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12205914 | Semiconductor package | Seokhyun Lee, Jongyoun Kim | 2025-01-21 |
| 11887931 | Semiconductor package with stepped redistribution structure exposing mold layer | Kyoung Lim Suk, Jaegwon Jang, Wonkyoung Choi | 2024-01-30 |