Issued Patents All Time
Showing 25 most recent of 37 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12417972 | Semiconductor package | — | 2025-09-16 |
| 12394753 | Semiconductor package | Hyeonseok LEE, Seokhyun Lee | 2025-08-19 |
| 12300625 | Semiconductor package including outer conductive plate | Minjung Kim, Dongkyu Kim, Seokhyun Lee, Jaegwon Jang | 2025-05-13 |
| 12293989 | Semiconductor package | Minjung Kim, Dongkyu Kim, Seokhyun Lee | 2025-05-06 |
| 12243813 | Connection structure and method of forming the same | — | 2025-03-04 |
| 12230556 | Semiconductor package and method of fabricating the same | Minjun Bae, Hyeonseok LEE, Gwangjae Jeon | 2025-02-18 |
| 12211777 | Semiconductor package including a dummy pattern | Minjung Kim, Dongkyu Kim, Hyeonjeong Hwang | 2025-01-28 |
| 12205914 | Semiconductor package | Inhyung SONG, Seokhyun Lee | 2025-01-21 |
| 12183690 | Semiconductor package | — | 2024-12-31 |
| 12068270 | Semiconductor package | — | 2024-08-20 |
| 12062621 | Semiconductor package | — | 2024-08-13 |
| 12057435 | Semiconductor package | Hyeonseok LEE, Seokhyun Lee | 2024-08-06 |
| 11973028 | Redistribution substrate, method of fabricating the same, and semiconductor package including the same | Seokhyun Lee, Minjun Bae | 2024-04-30 |
| 11948872 | Semiconductor package and method of fabricating the same | Minjun Bae, Hyeonseok LEE, Gwangjae Jeon | 2024-04-02 |
| 11929316 | Semiconductor package and method of fabricating the same | Eungkyu Kim, Gwangjae Jeon | 2024-03-12 |
| 11901276 | Semiconductor package and method of manufacturing the same | Yeonho Jang, Jungho Park, Jaegwon Jang | 2024-02-13 |
| 11869835 | Semiconductor package | Seokhyun Lee, Yeonho Jang, Jaegwon Jang | 2024-01-09 |
| 11837551 | Semiconductor package | Seokhyun Lee, Gwangjae Jeon | 2023-12-05 |
| 11810849 | Connection structure and method of forming the same | — | 2023-11-07 |
| 11646260 | Semiconductor package and method of fabricating the same | Eungkyu Kim, Gwangjae Jeon | 2023-05-09 |
| 11637081 | Semiconductor package and method of manufacturing the same | Jungho Park, Seokhyun Lee, Yeonho Jang, Jaegwon Jang | 2023-04-25 |
| 11600564 | Redistribution substrate, method of fabricating the same, and semiconductor package including the same | Seokhyun Lee, Minjun Bae | 2023-03-07 |
| 11569157 | Semiconductor package and method of manufacturing the same | Yeonho Jang, Jungho Park, Jaegwon Jang | 2023-01-31 |
| 11508649 | Semiconductor package including substrate with outer insulating layer | Eungkyu Kim, Gwangjae Jeon | 2022-11-22 |
| 11456241 | Semiconductor package | Seokhyun Lee, Yeonho Jang, Jaegwon Jang | 2022-09-27 |