Issued Patents All Time
Showing 26–37 of 37 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11437310 | Connection structure and method of forming the same | — | 2022-09-06 |
| 11387192 | Semiconductor package | — | 2022-07-12 |
| 11373954 | Semiconductor package | — | 2022-06-28 |
| 11145611 | Semiconductor package and method of manufacturing the same | Jungho Park, Seokhyun Lee, Yeonho Jang, Jaegwon Jang | 2021-10-12 |
| 11094636 | Semiconductor package and method of manufacturing the semiconductor package | Jaegwon Jang, Inwon O, Seokhyun Lee, Yeonho Jang | 2021-08-17 |
| 11018108 | Method of fabricating semiconductor package | Youn-ji Min, Seokhyun Lee, Kyoung Lim Suk, Seokwon Lee | 2021-05-25 |
| 10950539 | Redistribution substrate, method of fabricating the same, and semiconductor package including the same | Seokhyun Lee, Minjun Bae | 2021-03-16 |
| 10833002 | Connection structure and method of forming the same | — | 2020-11-10 |
| 10741518 | Method of fabricating semiconductor package | Youn-ji Min, Seokhyun Lee, Kyoung Lim Suk, Seokwon Lee | 2020-08-11 |
| 10685890 | Semiconductor package having redistribution pattern and passivation patterns and method of fabricating the same | Seokhyun Lee | 2020-06-16 |
| 10546829 | Method of fabricating semiconductor package | Youn-ji Min, Seokhyun Lee, Kyoung Lim Suk, Seokwon Lee | 2020-01-28 |
| 10319650 | Semiconductor package having redistribution pattern and passivation patterns and method of fabricating the same | Seokhyun Lee | 2019-06-11 |