Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12261104 | Semiconductor package and method of fabricating the same | Hyeonjeong Hwang, Dongkyu Kim, Minjung Kim | 2025-03-25 |
| 12087744 | Semiconductor package device | Dongkyu Kim, Seokhyun Lee, Jaegwon Jang | 2024-09-10 |
| 11901276 | Semiconductor package and method of manufacturing the same | Jongyoun Kim, Jungho Park, Jaegwon Jang | 2024-02-13 |
| 11869835 | Semiconductor package | Seokhyun Lee, Jongyoun Kim, Jaegwon Jang | 2024-01-09 |
| 11791295 | Semiconductor package with thick under-bump terminal | Gwangjae Jeon, Dongkyu Kim, Jung-Ho Park | 2023-10-17 |
| 11637081 | Semiconductor package and method of manufacturing the same | Jongyoun Kim, Jungho Park, Seokhyun Lee, Jaegwon Jang | 2023-04-25 |
| 11616051 | Semiconductor package device | Dongkyu Kim, Seokhyun Lee, Jaegwon Jang | 2023-03-28 |
| 11569157 | Semiconductor package and method of manufacturing the same | Jongyoun Kim, Jungho Park, Jaegwon Jang | 2023-01-31 |
| 11456241 | Semiconductor package | Seokhyun Lee, Jongyoun Kim, Jaegwon Jang | 2022-09-27 |
| 11145611 | Semiconductor package and method of manufacturing the same | Jongyoun Kim, Jungho Park, Seokhyun Lee, Jaegwon Jang | 2021-10-12 |
| 11094636 | Semiconductor package and method of manufacturing the semiconductor package | Jaegwon Jang, Inwon O, Jongyoun Kim, Seokhyun Lee | 2021-08-17 |
| 11056461 | Method of manufacturing fan-out wafer level package | Gwangjae Jeon, Dongkyu Kim, Jungho Park, Seokhyun Lee | 2021-07-06 |