Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12388040 | Semiconductor package including redistribution substrate and method of manufacturing the same | Seokhyun Lee, Dongkyu Kim, Kyounglim Suk | 2025-08-12 |
| 12381156 | Redistribution substrate and semiconductor package including the same | Dongkyu Kim, Kyoung Lim Suk, Wonjae Lee | 2025-08-05 |
| 12362253 | Semiconductor package and method of fabricating the same | Dongkyu Kim, Minjung Kim, Taewon Yoo | 2025-07-15 |
| 12261106 | Semiconductor package | Kyoung Lim Suk, Seokhyun Lee, Jaegwon Jang | 2025-03-25 |
| 12261104 | Semiconductor package and method of fabricating the same | Dongkyu Kim, Minjung Kim, Yeonho Jang | 2025-03-25 |
| 12211777 | Semiconductor package including a dummy pattern | Minjung Kim, Dongkyu Kim, Jongyoun Kim | 2025-01-28 |
| 12191236 | Semiconductor package | Minjung Kim, Dongkyu Kim, Taewon Yoo | 2025-01-07 |
| 12040264 | Semiconductor package including under bump metallization pad | Kyounglim Suk, Seokhyun Lee | 2024-07-16 |
| 12015018 | Semiconductor package with multiple redistribution substrates | Kyoung Lim Suk, Seokhyun Lee, Jaegwon Jang | 2024-06-18 |
| 11955499 | Image sensor package including glass substrate and a plurality of redistribution layers disposed below the glass substrate and spaced apart from each other by a predetermined distance | Minjung Kim, Dongkyu Kim, Kyounglim Suk, Jaegwon Jang | 2024-04-09 |
| 11538798 | Semiconductor package with multiple redistribution substrates | Kyoung Lim Suk, Seokhyun Lee, Jaegwon Jang | 2022-12-27 |