Issued Patents All Time
Showing 1–25 of 32 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12394700 | Semiconductor package | Dongkyu Kim, Seokhyun Lee, Jaegwon Jang, Gwangjae Jeon | 2025-08-19 |
| 12381156 | Redistribution substrate and semiconductor package including the same | Hyeonjeong Hwang, Dongkyu Kim, Wonjae Lee | 2025-08-05 |
| 12288780 | Semiconductor package | JU-YOUN CHOI, Wonjae Lee | 2025-04-29 |
| 12261106 | Semiconductor package | Hyeonjeong Hwang, Seokhyun Lee, Jaegwon Jang | 2025-03-25 |
| 12237256 | Semiconductor package | Keung Beum Kim, Dongkyu Kim, Minjung Kim, Seokhyun Lee | 2025-02-25 |
| 12170251 | Semiconductor package | Seokhyun Lee, Jaegwon Jang | 2024-12-17 |
| 12015018 | Semiconductor package with multiple redistribution substrates | Hyeonjeong Hwang, Seokhyun Lee, Jaegwon Jang | 2024-06-18 |
| 12014975 | Semiconductor package | Jaegwon Jang, Minjun Bae | 2024-06-18 |
| 12009350 | Semiconductor package and method of fabricating the same | Seokhyun Lee | 2024-06-11 |
| 11887931 | Semiconductor package with stepped redistribution structure exposing mold layer | Inhyung SONG, Jaegwon Jang, Wonkyoung Choi | 2024-01-30 |
| 11869775 | Semiconductor packages | Seokhyun Lee, Ae-Nee Jang, Jaegwon Jang | 2024-01-09 |
| 11810915 | Semiconductor package with redistribution substrate having embedded passive device | Seokhyun Lee, Jaegwon Jang | 2023-11-07 |
| 11804427 | Semiconductor package | Dongkyu Kim, Seokhyun Lee, Jaegwon Jang, Gwangjae Jeon | 2023-10-31 |
| 11694936 | Semiconductor package and method of fabricating the same | Minjung Kim, Seokhyun Lee | 2023-07-04 |
| 11626393 | Semiconductor package and method of fabricating the same | Seokhyun Lee | 2023-04-11 |
| 11610785 | Semiconductor packages | Seokhyun Lee, Ae-Nee Jang, Jaegwon Jang | 2023-03-21 |
| 11605584 | Semiconductor package | Keung Beum Kim, Dongkyu Kim, Minjung Kim, Seokhyun Lee | 2023-03-14 |
| 11538798 | Semiconductor package with multiple redistribution substrates | Hyeonjeong Hwang, Seokhyun Lee, Jaegwon Jang | 2022-12-27 |
| 11348876 | Semiconductor package and method of fabricating the same | Seung-Kwan Ryu, Seokhyun Lee | 2022-05-31 |
| 11152309 | Semiconductor package, method of fabricating semiconductor package, and method of fabricating redistribution structure | — | 2021-10-19 |
| 11107700 | Semiconductor package method of fabricating semiconductor package and method of fabricating re-distribution structure | — | 2021-08-31 |
| 11101231 | Semiconductor package and method of manufacturing the same | Jong Youn Kim, Seok Hyun LEE, Youn-ji Min, Seok-Won Lee | 2021-08-24 |
| 11018108 | Method of fabricating semiconductor package | Youn-ji Min, Seokhyun Lee, Jongyoun Kim, Seokwon Lee | 2021-05-25 |
| 10964643 | Semiconductor package and method of fabricating the same | Seokhyun Lee | 2021-03-30 |
| 10930625 | Semiconductor package and method of fabricating the same | Seokhyun Lee | 2021-02-23 |