| 12424561 |
Semiconductor package including interposer |
Yun-Seok Choi |
2025-09-23 |
| 11996366 |
Semiconductor package including interposer |
Yun-Seok Choi |
2024-05-28 |
| 11705391 |
Interposer and semiconductor package including the same |
Yu-Kyung Park, Min-Seung Yoon, Yun-Seok Choi |
2023-07-18 |
| 11676902 |
Semiconductor package including interposer |
Yun-Seok Choi |
2023-06-13 |
| 11348876 |
Semiconductor package and method of fabricating the same |
Kyoung Lim Suk, Seokhyun Lee |
2022-05-31 |
| 11244904 |
Semiconductor package including interposer |
Yun-Seok Choi |
2022-02-08 |
| 11217503 |
Semiconductor package having logic semiconductor chip and memory packages on interposer |
Yang Gyoo Jung, Chul Woo Kim, Hyo-Chang Ryu, Yun-Seok Choi |
2022-01-04 |
| 11081440 |
Interposer and semiconductor package including the same |
Yu-Kyung Park, Min-Seung Yoon, Yun-Seok Choi |
2021-08-03 |
| 10879187 |
Semiconductor package and method of fabricating the same |
Kyoung Lim Suk, Seokhyun Lee |
2020-12-29 |
| 10734367 |
Semiconductor package and method of fabricating the same |
Yonghwan Kwon, Yun-Seok Choi, Chajea Jo, Taeje Cho |
2020-08-04 |
| 10186500 |
Semiconductor package and method of fabricating the same |
Yonghwan Kwon, Yun-Seok Choi, Chajea Jo, Taeje Cho |
2019-01-22 |
| 10134702 |
Semiconductor chip, semiconductor package including the same, and method of manufacturing semiconductor chip |
Sun-kyoung Seo, Cha-Jea Jo, Tae-Je Cho |
2018-11-20 |
| 10008462 |
Semiconductor package |
Sun-kyoung Seo, Tae-Je Cho, Yong-Hwan Kwon, Hyung-Gil Baek, Hyun-Soo Chung +1 more |
2018-06-26 |
| 9972580 |
Semiconductor package and method for fabricating the same |
Yonghwan Kwon |
2018-05-15 |
| 9831202 |
Semiconductor devices with solder-based connection terminals and method of forming the same |
Sun-kyoung Seo, Ju-Il Choi, Tae-Je Cho, Yong-Hwan Kwon |
2017-11-28 |
| 9666551 |
Semiconductor chip, semiconductor package including the same, and method of manufacturing semiconductor chip |
Sun-kyoung Seo, Cha-Jea Jo, Tae-Je Cho |
2017-05-30 |
| 8039937 |
Method of forming semiconductor chips, the semiconductor chips so formed and chip-stack package having the same |
Hyun-Soo Chung, Ju-Il Choi, Dong-Ho Lee, Seong-Deok Hwang |
2011-10-18 |
| 7825495 |
Semiconductor chip structure, method of manufacturing the semiconductor chip structure, semiconductor chip package, and method of manufacturing the semiconductor chip package |
Hee-Kook Choi, Sung-Min Sim, Dong-Hyeon Jang |
2010-11-02 |
| 7544538 |
Method of forming semiconductor chips, the semiconductor chips so formed and chip-stack package having the same |
Hyun-Soo Chung, Ju-Il Choi, Dong-Ho Lee, Seong-Deok Hwang |
2009-06-09 |
| 7312143 |
Wafer level chip scale package having a gap and method for manufacturing the same |
Myeong-Soon Park, Hyun-Soo Chung, In-Young Lee, Jae-Sik Chung, Sung-Min Sim +2 more |
2007-12-25 |
| 7205660 |
Wafer level chip scale package having a gap and method for manufacturing the same |
Myeong-Soon Park, Hyun-Soo Chung, In-Young Lee, Jae-Sik Chung, Sung-Min Sim +2 more |
2007-04-17 |
