Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12433050 | Semiconductor package with protective mold | Sun Jae Kim, Yong-Hoe Cho | 2025-09-30 |
| 12040337 | Semiconductor package with protective mold | Sun Jae Kim, Yong-Hoe Cho | 2024-07-16 |
| 11610865 | Semiconductor package | Cha-Jea Jo, Soo Hyun Ha | 2023-03-21 |
| 10991677 | Semiconductor package | Cha-Jea Jo, Soo Hyun Ha | 2021-04-27 |
| 10867970 | Semiconductor package | Cha-Jea Jo, Soo Hyun Ha | 2020-12-15 |
| 10658341 | Semiconductor package | Cha-Jea Jo, Soo Hyun Ha | 2020-05-19 |
| 10373935 | Semiconductor package | Cha-Jea Jo, Soo Hyun Ha | 2019-08-06 |
| 10134702 | Semiconductor chip, semiconductor package including the same, and method of manufacturing semiconductor chip | Seung-Kwan Ryu, Cha-Jea Jo, Tae-Je Cho | 2018-11-20 |
| 10083939 | Semiconductor package | Cha-Jea Jo, Soo Hyun Ha | 2018-09-25 |
| 10008462 | Semiconductor package | Tae-Je Cho, Yong-Hwan Kwon, Hyung-Gil Baek, Hyun-Soo Chung, Seung-Kwan Ryu +1 more | 2018-06-26 |
| 9893018 | Alignment mark for semiconductor device | Yeong Kwon Ko, Tae Hyeong Kim, Ji Hwang Kim, Tae-Je Cho | 2018-02-13 |
| 9831202 | Semiconductor devices with solder-based connection terminals and method of forming the same | Seung-Kwan Ryu, Ju-Il Choi, Tae-Je Cho, Yong-Hwan Kwon | 2017-11-28 |
| 9666551 | Semiconductor chip, semiconductor package including the same, and method of manufacturing semiconductor chip | Seung-Kwan Ryu, Cha-Jea Jo, Tae-Je Cho | 2017-05-30 |
| 9543276 | Chip-stacked semiconductor package | Young Kun Jee, Tae Hong Min | 2017-01-10 |
| 9449930 | Semiconductor devices and package substrates having pillars and semiconductor packages and package stack structures having the same | Tae Hyeong Kim, Yeong Kwon Ko, Ji Hwang Kim, Tae-Je Cho | 2016-09-20 |
| 9376541 | Non-conductive film and non-conductive paste including zinc particles, semiconductor package including the same, and method of manufacturing the semiconductor package | Un-Byoung Kang, Kyung Wook Paik, Tae-Je Cho, Young Kun Jee, Yong Won Choi +1 more | 2016-06-28 |
| 9136255 | Methods of fabricating package stack structure and method of mounting package stack structure on system board | Eun Jin Choi | 2015-09-15 |
| 8742577 | Semiconductor package having an anti-contact layer | Young Kun Jee, Sang Wook Park, Ji Hwan Hwang | 2014-06-03 |
| 8735221 | Stacked package, method of fabricating stacked package, and method of mounting stacked package fabricated by the method | Jae-Wook Yoo | 2014-05-27 |
| 8698317 | Methods of fabricating package stack structure and method of mounting package stack structure on system board | Eun Jin Choi | 2014-04-15 |