Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183718 | Semiconductor package having a high reliability | Sang-Sick Park, Tae Hong Min, Geol Nam | 2024-12-31 |
| 11894346 | Semiconductor package having a high reliability | Sang-Sick Park, Tae Hong Min, Geol Nam | 2024-02-06 |
| 11887900 | Semiconductor package including test pad | Hyuek Jae Lee, Tae Hun Kim, Ji Hoon Kim, Ji-Seok Hong | 2024-01-30 |
| 11887968 | Method of manufacturing a semiconductor package | Ji Hoon Kim, Ji-Seok Hong, Tae Hun Kim, Hyuek Jae Lee | 2024-01-30 |
| 11664352 | Semiconductor package having a high reliability | Sang-Sick Park, Tae Hong Min, Geol Nam | 2023-05-30 |
| 11581257 | Semiconductor package | Hyuek Jae Lee, Ji Hoon Kim, Tae Hun Kim, Ji-Seok Hong | 2023-02-14 |
| 11545458 | Semiconductor package | Sun Chul Kim, Tae Hun Kim | 2023-01-03 |
| 11145626 | Semiconductor package | Ji Hoon Kim, Ji-Seok Hong, Tae Hun Kim, Hyuek Jae Lee | 2021-10-12 |
| 11088038 | Semiconductor package including test pad | Hyuek Jae Lee, Tae Hun Kim, Ji Hoon Kim, Ji-Seok Hong | 2021-08-10 |
| 11056432 | Semiconductor package | Hyuek Jae Lee, Ji Hoon Kim, Tae Hun Kim, Ji-Seok Hong | 2021-07-06 |
| 11018115 | Semiconductor package having a high reliability | Sang-Sick Park, Tae Hong Min, Geol Nam | 2021-05-25 |
| 10971470 | Semiconductor package | Sun Chul Kim, Tae Hun Kim | 2021-04-06 |
| 10957833 | Light emitting diode display device | Tan Sakong, Yong-Il Kim, Han Kyu Seong, Ji Hye Yeon, Chung-Sun Lee | 2021-03-23 |
| 10930613 | Semiconductor package having recessed adhesive layer between stacked chips | Sang-Sick Park, Un-Byoung Kang, Tae Hong Min, Teak-Hoon Lee | 2021-02-23 |
| 10886255 | Die stack structure, semiconductor package having the same and method of manufacturing the same | Ji-Seok Hong, Ji Hoon Kim, Tae Hun Kim, Hyuek Jae Lee | 2021-01-05 |
| 10622335 | Semiconductor package having a high reliability | Sang-Sick Park, Tae Hong Min, Geol Nam | 2020-04-14 |
| 10483150 | Apparatus for stacking semiconductor chips in a semiconductor package | Gun Lee, Cha-Jea Jo, Dong-Han Kim, Seung-Kon Mok | 2019-11-19 |
| 10153255 | Semiconductor package having a high reliability | Sang-Sick Park, Tae Hong Min, Geol Nam | 2018-12-11 |
| 9893121 | Magnetic memory and method of manufacturing magnetic memory | Yasuyuki Sonoda, Masahiko Nakayama, Min-Suk Lee, Masatoshi Yoshikawa, Kuniaki SUGIURA | 2018-02-13 |
| 8791562 | Stack package and semiconductor package including the same | Chung-Sun Lee, Jung-Hwan Kim, Yun-Hyeok Im, Hyon-chol Kim, Kwang-chul Choi +2 more | 2014-07-29 |
| 8742577 | Semiconductor package having an anti-contact layer | Young Kun Jee, Sun-kyoung Seo, Sang Wook Park | 2014-06-03 |
| 8339561 | Wiring substrate, tape package having the same, and display device having the same | Dong-Han Kim, Chul Woo Kim, Chung-Ye Chung, Kwang-Jin Bae | 2012-12-25 |