Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10546844 | Stack package and method of manufacturing the stack package | Jae Choon Kim, Eon Soo Jang, Eun-Hee Jung, Byeong-Yeon Cho | 2020-01-28 |
| 10431536 | Interposer substrate and semiconductor package | Bok-Sik Myung, Ok-Gyeong Park | 2019-10-01 |
| 9048168 | Semiconductor packages having warpage compensation | Heung-Kyu Kwon, Seok-Won Lee, Su-chang Lee, Chi-Young Lee | 2015-06-02 |
| 9040351 | Stack packages having fastening element and halogen-free inter-package connector | Heung-Kyu Kwon, Jae-Wook Yoo, Su-chang Lee, Min-Ok Na | 2015-05-26 |
| 8791562 | Stack package and semiconductor package including the same | Chung-Sun Lee, Jung-Hwan Kim, Yun-Hyeok Im, Ji Hwan Hwang, Kwang-chul Choi +2 more | 2014-07-29 |
| 8604614 | Semiconductor packages having warpage compensation | Heung-Kyu Kwon, Seok-Won Lee, Su-chang Lee, Chi-Young Lee | 2013-12-10 |